
Intel Corporation
10AX057N3F40I2LG
10AX057N3F40I2LG ECAD Model
10AX057N3F40I2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 588 | |
Number of Outputs | 588 | |
Number of Logic Cells | 570000 | |
Number of CLBs | 21708 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 21708 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX057N3F40I2LG Datasheet Download
10AX057N3F40I2LG Overview
The chip model 10AX057N3F40I2LG is a high-performance integrated circuit (IC) designed to provide optimal performance in digital signal processing, embedded processing, and image processing applications. It is designed to be programmed in HDL (Hardware Description Language) and has been designed to meet the needs of the most demanding applications.
The 10AX057N3F40I2LG chip model has several advantages that make it an attractive solution for a variety of applications. It is a low-power, low-cost, and high-performance solution that offers a wide range of features and functions. It is also highly scalable, meaning it can be configured to meet the needs of any application. It is also designed to be easily integrated into existing systems, allowing for a seamless transition to the latest technology.
The 10AX057N3F40I2LG chip model is expected to become increasingly popular in the coming years, as more applications require the use of high-performance digital signal processing and embedded processing solutions. This is due to the increasing demand for more powerful and efficient solutions. As the technology advances, the 10AX057N3F40I2LG chip model will become even more attractive for applications that require the highest levels of performance and efficiency.
The original design intention of the 10AX057N3F40I2LG chip model was to provide a powerful and efficient solution for digital signal processing, embedded processing, and image processing applications. It was designed to be easily integrated into existing systems and to provide a wide range of features and functions. The chip model is also designed to be highly scalable, meaning it can be configured to meet the needs of any application.
The 10AX057N3F40I2LG chip model is also designed to be upgradable, allowing for future upgrades and enhancements. This means that the chip model can be applied to advanced communication systems, as the technology advances. This makes the 10AX057N3F40I2LG chip model an attractive solution for a variety of applications, as it is designed to be easily integrated into existing systems and to provide a wide range of features and functions.
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4,660 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $15,955.6434 | $15,955.6434 |
10+ | $15,784.0773 | $157,840.7734 |
100+ | $14,926.2470 | $1,492,624.7046 |
1000+ | $14,068.4168 | $7,034,208.3780 |
10000+ | $12,867.4544 | $12,867,454.3500 |
The price is for reference only, please refer to the actual quotation! |