10AX057N3F40I2LG
10AX057N3F40I2LG
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rohs

Intel Corporation

10AX057N3F40I2LG


10AX057N3F40I2LG
F18-10AX057N3F40I2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

10AX057N3F40I2LG ECAD Model


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10AX057N3F40I2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 588
Number of Outputs 588
Number of Logic Cells 570000
Number of CLBs 21708
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 21708 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX057N3F40I2LG Datasheet Download


10AX057N3F40I2LG Overview



The chip model 10AX057N3F40I2LG is a high-performance integrated circuit (IC) designed to provide optimal performance in digital signal processing, embedded processing, and image processing applications. It is designed to be programmed in HDL (Hardware Description Language) and has been designed to meet the needs of the most demanding applications.


The 10AX057N3F40I2LG chip model has several advantages that make it an attractive solution for a variety of applications. It is a low-power, low-cost, and high-performance solution that offers a wide range of features and functions. It is also highly scalable, meaning it can be configured to meet the needs of any application. It is also designed to be easily integrated into existing systems, allowing for a seamless transition to the latest technology.


The 10AX057N3F40I2LG chip model is expected to become increasingly popular in the coming years, as more applications require the use of high-performance digital signal processing and embedded processing solutions. This is due to the increasing demand for more powerful and efficient solutions. As the technology advances, the 10AX057N3F40I2LG chip model will become even more attractive for applications that require the highest levels of performance and efficiency.


The original design intention of the 10AX057N3F40I2LG chip model was to provide a powerful and efficient solution for digital signal processing, embedded processing, and image processing applications. It was designed to be easily integrated into existing systems and to provide a wide range of features and functions. The chip model is also designed to be highly scalable, meaning it can be configured to meet the needs of any application.


The 10AX057N3F40I2LG chip model is also designed to be upgradable, allowing for future upgrades and enhancements. This means that the chip model can be applied to advanced communication systems, as the technology advances. This makes the 10AX057N3F40I2LG chip model an attractive solution for a variety of applications, as it is designed to be easily integrated into existing systems and to provide a wide range of features and functions.



4,660 In Stock


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Unit Price: $17,156.6058
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $15,955.6434 $15,955.6434
10+ $15,784.0773 $157,840.7734
100+ $14,926.2470 $1,492,624.7046
1000+ $14,068.4168 $7,034,208.3780
10000+ $12,867.4544 $12,867,454.3500
The price is for reference only, please refer to the actual quotation!

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