Intel Corporation
10AX057N3F40E2LG
10AX057N3F40E2LG ECAD Model
10AX057N3F40E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 588 | |
| Number of Outputs | 588 | |
| Number of Logic Cells | 570000 | |
| Number of CLBs | 21708 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 21708 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1517 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1517 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1517,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1517,39X39,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX057N3F40E2LG Datasheet Download
10AX057N3F40E2LG Overview
The chip model 10AX057N3F40E2LG is a highly advanced semiconductor device that has revolutionized the way we process, store, and transmit data. Developed by the leading semiconductor manufacturer, this model has been designed to provide a reliable, efficient, and cost-effective solution for a wide variety of applications.
The 10AX057N3F40E2LG chip model is designed to provide high performance and low power consumption. It supports a wide range of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and Z-Wave. It also features a wide range of advanced features, such as error correction, signal processing, and encryption. Additionally, it is designed to be easily upgradable, allowing users to upgrade their hardware without having to replace their entire system.
The 10AX057N3F40E2LG chip model is rapidly becoming one of the most popular semiconductor devices in the market. It has been widely adopted by a variety of industries, including the medical, automotive, industrial, and consumer electronics sectors. As more and more applications require advanced communication systems, the 10AX057N3F40E2LG chip model is expected to become even more popular.
The 10AX057N3F40E2LG chip model is designed to meet the ever-changing needs of the market. Its original design intention was to provide a reliable, efficient, and cost-effective solution for a wide variety of applications. It has been designed to be easily upgradable, allowing users to upgrade their hardware without having to replace their entire system. This allows users to keep up with the latest technologies without having to invest in new hardware.
The 10AX057N3F40E2LG chip model is expected to remain a popular choice for a wide variety of applications. As the technology continues to evolve and new technologies become available, the 10AX057N3F40E2LG chip model is expected to remain an important part of the semiconductor industry. It is also expected to be able to support advanced communication systems, making it an ideal choice for a variety of applications.
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1,686 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,131.5109 | $3,131.5109 |
| 10+ | $3,097.8387 | $30,978.3872 |
| 100+ | $2,929.4779 | $292,947.7920 |
| 1000+ | $2,761.1171 | $1,380,558.5600 |
| 10000+ | $2,525.4120 | $2,525,412.0000 |
| The price is for reference only, please refer to the actual quotation! | ||