
Intel Corporation
10AX057K4F35I3SG
10AX057K4F35I3SG ECAD Model
10AX057K4F35I3SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 396 | |
Number of Outputs | 396 | |
Number of Logic Cells | 570000 | |
Number of CLBs | 21708 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 21708 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX057K4F35I3SG Datasheet Download
10AX057K4F35I3SG Overview
The chip model 10AX057K4F35I3SG is a high-performance integrated circuit that is suitable for a wide range of applications, including digital signal processing, embedded processing, image processing, and more. It is designed to be used with HDL language, which stands for hardware description language. This language is used to program and control hardware components, making it an ideal choice for those looking for a reliable and efficient integrated circuit.
The 10AX057K4F35I3SG chip model is equipped with a range of features that make it an attractive option for many applications. It has a high-speed performance, which is essential for digital signal processing, embedded processing, and image processing. It also has a low power consumption, making it a great choice for applications that require energy efficiency. Additionally, it has a wide range of input and output options, allowing for greater flexibility in its use.
The 10AX057K4F35I3SG chip model is expected to be in high demand in the future. This is due to the increasing need for high-performance integrated circuits in various industries. With its wide range of features and its compatibility with HDL language, the 10AX057K4F35I3SG chip model is an ideal choice for many applications.
When designing with the 10AX057K4F35I3SG chip model, it is important to consider the specific design requirements. This includes the type of clock frequency, the type of memory, the type of input and output, and the type of peripherals that will be used. Additionally, it is important to consider any potential risks associated with the chip model, such as overheating or power consumption.
To illustrate the use of the 10AX057K4F35I3SG chip model, there are several case studies available. These case studies provide an in-depth look at how the chip model is used in real-world applications. Additionally, there are also several precautions that should be taken when using the chip model. These include ensuring that the chip model is properly cooled, that the power supply is stable, and that the HDL language is properly programmed.
In conclusion, the 10AX057K4F35I3SG chip model is a high-performance integrated circuit that is suitable for a wide range of applications. It is designed to be used with HDL language, which stands for hardware description language. This language is used to program and control hardware components, making it an ideal choice for those looking for a reliable and efficient integrated circuit. The 10AX057K4F35I3SG chip model is expected to be in high demand in the future, and it is important to consider the specific design requirements and potential risks associated with the chip model when designing with it. Additionally, there are several case studies and precautions that should be taken when using the chip model.
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4,551 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $8,636.3662 | $8,636.3662 |
10+ | $8,543.5021 | $85,435.0208 |
100+ | $8,079.1813 | $807,918.1311 |
1000+ | $7,614.8605 | $3,807,430.2730 |
10000+ | $6,964.8115 | $6,964,811.4750 |
The price is for reference only, please refer to the actual quotation! |