10AX057K4F35I3SG
10AX057K4F35I3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX057K4F35I3SG


10AX057K4F35I3SG
F18-10AX057K4F35I3SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX057K4F35I3SG ECAD Model


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10AX057K4F35I3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 396
Number of Outputs 396
Number of Logic Cells 570000
Number of CLBs 21708
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 21708 CLBS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX057K4F35I3SG Datasheet Download


10AX057K4F35I3SG Overview



The chip model 10AX057K4F35I3SG is a high-performance integrated circuit that is suitable for a wide range of applications, including digital signal processing, embedded processing, image processing, and more. It is designed to be used with HDL language, which stands for hardware description language. This language is used to program and control hardware components, making it an ideal choice for those looking for a reliable and efficient integrated circuit.


The 10AX057K4F35I3SG chip model is equipped with a range of features that make it an attractive option for many applications. It has a high-speed performance, which is essential for digital signal processing, embedded processing, and image processing. It also has a low power consumption, making it a great choice for applications that require energy efficiency. Additionally, it has a wide range of input and output options, allowing for greater flexibility in its use.


The 10AX057K4F35I3SG chip model is expected to be in high demand in the future. This is due to the increasing need for high-performance integrated circuits in various industries. With its wide range of features and its compatibility with HDL language, the 10AX057K4F35I3SG chip model is an ideal choice for many applications.


When designing with the 10AX057K4F35I3SG chip model, it is important to consider the specific design requirements. This includes the type of clock frequency, the type of memory, the type of input and output, and the type of peripherals that will be used. Additionally, it is important to consider any potential risks associated with the chip model, such as overheating or power consumption.


To illustrate the use of the 10AX057K4F35I3SG chip model, there are several case studies available. These case studies provide an in-depth look at how the chip model is used in real-world applications. Additionally, there are also several precautions that should be taken when using the chip model. These include ensuring that the chip model is properly cooled, that the power supply is stable, and that the HDL language is properly programmed.


In conclusion, the 10AX057K4F35I3SG chip model is a high-performance integrated circuit that is suitable for a wide range of applications. It is designed to be used with HDL language, which stands for hardware description language. This language is used to program and control hardware components, making it an ideal choice for those looking for a reliable and efficient integrated circuit. The 10AX057K4F35I3SG chip model is expected to be in high demand in the future, and it is important to consider the specific design requirements and potential risks associated with the chip model when designing with it. Additionally, there are several case studies and precautions that should be taken when using the chip model.



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Unit Price: $9,286.4153
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QTY Unit Price Ext Price
1+ $8,636.3662 $8,636.3662
10+ $8,543.5021 $85,435.0208
100+ $8,079.1813 $807,918.1311
1000+ $7,614.8605 $3,807,430.2730
10000+ $6,964.8115 $6,964,811.4750
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