
Intel Corporation
10AX057K4F35I3LG
10AX057K4F35I3LG ECAD Model
10AX057K4F35I3LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 396 | |
Number of Outputs | 396 | |
Number of Logic Cells | 570000 | |
Number of CLBs | 21708 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 21708 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX057K4F35I3LG Datasheet Download
10AX057K4F35I3LG Overview
The chip model 10AX057K4F35I3LG is a high-performance chip developed by Intel, suitable for a variety of digital signal processing, embedded processing, and image processing related applications. It is an integrated circuit that requires the use of HDL language, which is a hardware description language used to describe the behavior and structure of electronic systems.
The 10AX057K4F35I3LG chip model has many advantages over other chip models, such as its high-performance processing capabilities, its low power consumption, and its small size. This makes it well suited for applications where space and power are limited, such as in embedded systems. In addition, its ability to process digital signals quickly and efficiently makes it ideal for high-performance digital signal processing applications.
The 10AX057K4F35I3LG chip model is expected to be in high demand in the future, as more and more industries are looking to integrate digital signal processing and embedded processing into their products. This chip model is also expected to be used in the development and popularization of future intelligent robots, as it is capable of handling complex tasks and data processing in a small form factor.
In order to use the 10AX057K4F35I3LG chip model effectively, technical talents with experience in HDL language are needed. Those who are familiar with digital signal processing and embedded processing should also have a good understanding of the chip model, as they will be able to use it to its fullest potential. With the increasing demand for the 10AX057K4F35I3LG chip model in the future, it is likely that more and more technical talents will be needed to use it effectively.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $10,796.2669 | $10,796.2669 |
10+ | $10,680.1780 | $106,801.7797 |
100+ | $10,099.7335 | $1,009,973.3517 |
1000+ | $9,519.2891 | $4,759,644.5310 |
10000+ | $8,706.6668 | $8,706,666.8250 |
The price is for reference only, please refer to the actual quotation! |