
Intel Corporation
10AX057K3F35E2SG
10AX057K3F35E2SG ECAD Model
10AX057K3F35E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 396 | |
Number of Outputs | 396 | |
Number of Logic Cells | 570000 | |
Number of CLBs | 21708 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 21708 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX057K3F35E2SG Datasheet Download
10AX057K3F35E2SG Overview
The chip model 10AX057K3F35E2SG is a powerful and highly integrated semiconductor device designed for advanced communication systems. It is designed to provide reliable and efficient performance in a variety of scenarios, including high-speed data transfer and digital signal processing. The chip offers a wide range of features and capabilities, including a high-speed processor, a high-speed memory controller, and a multi-channel digital signal processor.
The original design intention of the chip model 10AX057K3F35E2SG was to provide a reliable, high-performance platform for advanced communication systems. The chip is designed to provide maximum performance and efficiency in a variety of scenarios, including high-speed data transfer, digital signal processing, and other complex tasks. It is also designed to be easily upgradable, allowing for future upgrades and enhancements.
The chip model 10AX057K3F35E2SG is suitable for use in a variety of networks, including wireless, Ethernet, and optical networks. It can also be applied to intelligent scenarios, such as voice recognition and machine learning. The chip is also suitable for use in the era of fully intelligent systems, as it is designed to be able to handle complex tasks and provide reliable performance in a variety of scenarios.
The product description of the chip model 10AX057K3F35E2SG includes a detailed list of features and capabilities. It is designed to provide a high-speed processor, a high-speed memory controller, and a multi-channel digital signal processor. It also includes a variety of peripherals, such as USB, Ethernet, and serial ports, as well as a variety of other features.
In addition to the product description, there are also a number of case studies available which provide information on the actual performance of the chip model 10AX057K3F35E2SG in various scenarios. These case studies can be used to gain an understanding of the performance of the chip in different scenarios, as well as to identify any potential issues or areas for improvement.
Finally, there are a number of precautions which should be taken when using the chip model 10AX057K3F35E2SG, including ensuring that the chip is properly installed and configured, and that all necessary precautions are taken to protect the chip from damage. Additionally, the chip should be regularly monitored and maintained in order to ensure that it remains in optimal condition.
In conclusion, the chip model 10AX057K3F35E2SG is a powerful and highly integrated semiconductor device designed for advanced communication systems. It is designed to provide reliable and efficient performance in a variety of scenarios, including high-speed data transfer and digital signal processing. The chip is suitable for use in a variety of networks, including wireless, Ethernet, and optical networks, as well as for use in intelligent scenarios. It is also designed to be easily upgradable, allowing for future upgrades and enhancements. The product description and case studies provide information on the features and capabilities of the chip, as well as its performance in various scenarios. Finally, there are a number of precautions which should be taken when using the chip model 10AX057K3F35E2SG, in order to ensure that it remains in optimal condition.
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1,226 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $9,499.9924 | $9,499.9924 |
10+ | $9,397.8420 | $93,978.4195 |
100+ | $8,887.0897 | $888,708.9672 |
1000+ | $8,376.3374 | $4,188,168.6960 |
10000+ | $7,661.2842 | $7,661,284.2000 |
The price is for reference only, please refer to the actual quotation! |