10AX057K3F35E2SG
10AX057K3F35E2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX057K3F35E2SG


10AX057K3F35E2SG
F18-10AX057K3F35E2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX057K3F35E2SG ECAD Model


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10AX057K3F35E2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 396
Number of Outputs 396
Number of Logic Cells 570000
Number of CLBs 21708
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 21708 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX057K3F35E2SG Datasheet Download


10AX057K3F35E2SG Overview



The chip model 10AX057K3F35E2SG is a powerful and highly integrated semiconductor device designed for advanced communication systems. It is designed to provide reliable and efficient performance in a variety of scenarios, including high-speed data transfer and digital signal processing. The chip offers a wide range of features and capabilities, including a high-speed processor, a high-speed memory controller, and a multi-channel digital signal processor.


The original design intention of the chip model 10AX057K3F35E2SG was to provide a reliable, high-performance platform for advanced communication systems. The chip is designed to provide maximum performance and efficiency in a variety of scenarios, including high-speed data transfer, digital signal processing, and other complex tasks. It is also designed to be easily upgradable, allowing for future upgrades and enhancements.


The chip model 10AX057K3F35E2SG is suitable for use in a variety of networks, including wireless, Ethernet, and optical networks. It can also be applied to intelligent scenarios, such as voice recognition and machine learning. The chip is also suitable for use in the era of fully intelligent systems, as it is designed to be able to handle complex tasks and provide reliable performance in a variety of scenarios.


The product description of the chip model 10AX057K3F35E2SG includes a detailed list of features and capabilities. It is designed to provide a high-speed processor, a high-speed memory controller, and a multi-channel digital signal processor. It also includes a variety of peripherals, such as USB, Ethernet, and serial ports, as well as a variety of other features.


In addition to the product description, there are also a number of case studies available which provide information on the actual performance of the chip model 10AX057K3F35E2SG in various scenarios. These case studies can be used to gain an understanding of the performance of the chip in different scenarios, as well as to identify any potential issues or areas for improvement.


Finally, there are a number of precautions which should be taken when using the chip model 10AX057K3F35E2SG, including ensuring that the chip is properly installed and configured, and that all necessary precautions are taken to protect the chip from damage. Additionally, the chip should be regularly monitored and maintained in order to ensure that it remains in optimal condition.


In conclusion, the chip model 10AX057K3F35E2SG is a powerful and highly integrated semiconductor device designed for advanced communication systems. It is designed to provide reliable and efficient performance in a variety of scenarios, including high-speed data transfer and digital signal processing. The chip is suitable for use in a variety of networks, including wireless, Ethernet, and optical networks, as well as for use in intelligent scenarios. It is also designed to be easily upgradable, allowing for future upgrades and enhancements. The product description and case studies provide information on the features and capabilities of the chip, as well as its performance in various scenarios. Finally, there are a number of precautions which should be taken when using the chip model 10AX057K3F35E2SG, in order to ensure that it remains in optimal condition.



1,226 In Stock


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Unit Price: $10,215.0456
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $9,499.9924 $9,499.9924
10+ $9,397.8420 $93,978.4195
100+ $8,887.0897 $888,708.9672
1000+ $8,376.3374 $4,188,168.6960
10000+ $7,661.2842 $7,661,284.2000
The price is for reference only, please refer to the actual quotation!

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