10AX057K1F40I1SG
10AX057K1F40I1SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX057K1F40I1SG


10AX057K1F40I1SG
F18-10AX057K1F40I1SG
Active
FIELD PROGRAMMABLE GATE ARRAY, BGA, BGA1517,39X39,40
BGA, BGA1517,39X39,40

10AX057K1F40I1SG ECAD Model


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10AX057K1F40I1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 900 mV
Number of Inputs 696
Number of Outputs 696
Number of Logic Cells 570000
Number of CLBs 21708
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Organization 21708 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1517
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1517
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1517,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1517,39X39,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX057K1F40I1SG Datasheet Download


10AX057K1F40I1SG Overview



The 10AX057K1F40I1SG chip model is a powerful and reliable component designed to meet the needs of modern communication systems. Developed by the renowned semiconductor manufacturer, Intel, the chip model is a versatile and powerful component that is capable of supporting a wide range of applications.


The 10AX057K1F40I1SG chip model was designed with the intention of providing a reliable and efficient solution for communication systems. The chip model is capable of supporting a variety of applications, including high-speed data transfer, high-speed networking, and advanced communication systems. It is also capable of supporting a wide range of protocols, including Ethernet, Wi-Fi, and Bluetooth.


The 10AX057K1F40I1SG chip model is also designed to be upgradable. This means that it is possible to upgrade the chip model to take advantage of new technologies and protocols as they become available. This makes the chip model ideal for use in the era of fully intelligent systems, as it can be easily upgraded to take advantage of new developments.


The 10AX057K1F40I1SG chip model is also capable of being applied to a variety of intelligent scenarios. It is capable of supporting the development of autonomous vehicles, intelligent home systems, smart energy grids, and other intelligent systems. It is also capable of supporting the development of advanced communication systems, such as 5G networks and the Internet of Things (IoT).


In order to ensure that the 10AX057K1F40I1SG chip model meets the specific design requirements of its intended application, it is important to consider a number of factors. These include the power consumption of the chip model, the speed of the chip model, and the reliability of the chip model. In addition, it is important to consider the specific design requirements of the application, such as the number of devices that will be connected to the chip model, the number of data points that will be transferred, and the type of data that will be transferred.


Case studies can also be used to evaluate the 10AX057K1F40I1SG chip model. These case studies can provide valuable insight into the performance of the chip model in various scenarios and can be used to determine whether the chip model is suitable for the application. In addition, these case studies can provide valuable insight into the potential risks associated with using the chip model.


In conclusion, the 10AX057K1F40I1SG chip model is a powerful and reliable component designed to meet the needs of modern communication systems. It is capable of supporting a variety of applications, including high-speed data transfer, high-speed networking, and advanced communication systems. It is also upgradable, making it ideal for use in the era of fully intelligent systems. In addition, the chip model is capable of being applied to a variety of intelligent scenarios, such as autonomous vehicles, intelligent home systems, and smart energy grids. Finally, it is important to consider the specific design requirements of the application, as well as the potential risks associated with using the chip model, before making a decision.



4,347 In Stock


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Unit Price: $14,376.365
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $13,370.0195 $13,370.0195
10+ $13,226.2558 $132,262.5580
100+ $12,507.4376 $1,250,743.7550
1000+ $11,788.6193 $5,894,309.6500
10000+ $10,782.2738 $10,782,273.7500
The price is for reference only, please refer to the actual quotation!

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