
Intel Corporation
10AX057K1F40I1SG
10AX057K1F40I1SG ECAD Model
10AX057K1F40I1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 696 | |
Number of Outputs | 696 | |
Number of Logic Cells | 570000 | |
Number of CLBs | 21708 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Organization | 21708 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1517,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1517,39X39,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX057K1F40I1SG Datasheet Download
10AX057K1F40I1SG Overview
The 10AX057K1F40I1SG chip model is a powerful and reliable component designed to meet the needs of modern communication systems. Developed by the renowned semiconductor manufacturer, Intel, the chip model is a versatile and powerful component that is capable of supporting a wide range of applications.
The 10AX057K1F40I1SG chip model was designed with the intention of providing a reliable and efficient solution for communication systems. The chip model is capable of supporting a variety of applications, including high-speed data transfer, high-speed networking, and advanced communication systems. It is also capable of supporting a wide range of protocols, including Ethernet, Wi-Fi, and Bluetooth.
The 10AX057K1F40I1SG chip model is also designed to be upgradable. This means that it is possible to upgrade the chip model to take advantage of new technologies and protocols as they become available. This makes the chip model ideal for use in the era of fully intelligent systems, as it can be easily upgraded to take advantage of new developments.
The 10AX057K1F40I1SG chip model is also capable of being applied to a variety of intelligent scenarios. It is capable of supporting the development of autonomous vehicles, intelligent home systems, smart energy grids, and other intelligent systems. It is also capable of supporting the development of advanced communication systems, such as 5G networks and the Internet of Things (IoT).
In order to ensure that the 10AX057K1F40I1SG chip model meets the specific design requirements of its intended application, it is important to consider a number of factors. These include the power consumption of the chip model, the speed of the chip model, and the reliability of the chip model. In addition, it is important to consider the specific design requirements of the application, such as the number of devices that will be connected to the chip model, the number of data points that will be transferred, and the type of data that will be transferred.
Case studies can also be used to evaluate the 10AX057K1F40I1SG chip model. These case studies can provide valuable insight into the performance of the chip model in various scenarios and can be used to determine whether the chip model is suitable for the application. In addition, these case studies can provide valuable insight into the potential risks associated with using the chip model.
In conclusion, the 10AX057K1F40I1SG chip model is a powerful and reliable component designed to meet the needs of modern communication systems. It is capable of supporting a variety of applications, including high-speed data transfer, high-speed networking, and advanced communication systems. It is also upgradable, making it ideal for use in the era of fully intelligent systems. In addition, the chip model is capable of being applied to a variety of intelligent scenarios, such as autonomous vehicles, intelligent home systems, and smart energy grids. Finally, it is important to consider the specific design requirements of the application, as well as the potential risks associated with using the chip model, before making a decision.
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4,347 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $13,370.0195 | $13,370.0195 |
10+ | $13,226.2558 | $132,262.5580 |
100+ | $12,507.4376 | $1,250,743.7550 |
1000+ | $11,788.6193 | $5,894,309.6500 |
10000+ | $10,782.2738 | $10,782,273.7500 |
The price is for reference only, please refer to the actual quotation! |