Intel Corporation
10AX057H3F34I2SG
10AX057H3F34I2SG ECAD Model
10AX057H3F34I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 570000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.65 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX057H3F34I2SG Overview
The chip model 10AX057H3F34I2SG is a cutting-edge technology that is revolutionizing the semiconductor industry with its high performance, low power consumption, and low cost. It is a multi-core processor with a 64-bit instruction set architecture and a wide range of applications. As the technology continues to evolve, the chip model 10AX057H3F34I2SG is becoming increasingly popular in the industry due to its high performance and low power consumption.
The original design intention of the chip model 10AX057H3F34I2SG was to provide a cost-effective solution for a wide range of applications. It is designed to be used in a variety of scenarios, from consumer electronics to industrial automation. It is also capable of supporting a wide range of communication protocols, including Wi-Fi, Bluetooth, and ZigBee. The chip model 10AX057H3F34I2SG is also capable of supporting a wide range of operating systems, including Windows, Linux, and Android.
The chip model 10AX057H3F34I2SG is also capable of being upgraded in the future. It is designed with a modular architecture, allowing for easy upgradeability. This means that the chip model 10AX057H3F34I2SG can be upgraded to support new technologies, such as 5G and artificial intelligence (AI). This will allow the chip model 10AX057H3F34I2SG to be used in advanced communication systems, networks, and intelligent scenarios.
The chip model 10AX057H3F34I2SG has the potential to be used in the era of fully intelligent systems. It is capable of supporting a wide range of AI applications, such as natural language processing and image recognition. This will allow the chip model 10AX057H3F34I2SG to be used in a variety of intelligent scenarios, such as autonomous vehicles and smart homes.
In conclusion, the chip model 10AX057H3F34I2SG is a cutting-edge technology that is revolutionizing the semiconductor industry with its high performance, low power consumption, and low cost. It is designed to be used in a variety of scenarios, from consumer electronics to industrial automation. It is also capable of being upgraded in the future to support new technologies, such as 5G and AI. This will allow the chip model 10AX057H3F34I2SG to be used in advanced communication systems, networks, and intelligent scenarios.
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4,595 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||