10AX057H3F34I2LG
10AX057H3F34I2LG
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rohs

Intel Corporation

10AX057H3F34I2LG


10AX057H3F34I2LG
F18-10AX057H3F34I2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX057H3F34I2LG ECAD Model


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10AX057H3F34I2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 492
Number of Outputs 492
Number of Logic Cells 570000
Number of CLBs 21708
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 21708 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.39.00.01

10AX057H3F34I2LG Datasheet Download


10AX057H3F34I2LG Overview



The chip model 10AX057H3F34I2LG is a cutting-edge semiconductor technology developed by a leading chip manufacturer. It is designed to power a variety of applications, from high-performance computing to embedded systems. The chip model is capable of delivering high performance, low power consumption, and high reliability. It also supports a wide range of digital and analog I/O, as well as integrated memory and storage.


As the industry trends in chip model 10AX057H3F34I2LG continue to evolve, it is expected that the demand for this model will continue to grow in the future. This is due to the chip's ability to provide high-performance computing, low power consumption, and high reliability. Additionally, the chip model is designed to be compatible with a variety of applications and is capable of supporting new technologies as they become available.


The chip model 10AX057H3F34I2LG can be applied to a variety of networks, from wireless networks to industrial networks. It can also be used in intelligent scenarios, such as autonomous vehicles, smart homes, and industrial automation. The chip model is also capable of supporting the development of fully intelligent systems, such as artificial intelligence, machine learning, and robotics.


In conclusion, the chip model 10AX057H3F34I2LG is a cutting-edge semiconductor technology that is capable of powering a variety of applications. It is expected to be in high demand in the future due to its ability to provide high performance, low power consumption, and high reliability. Additionally, the chip model is capable of supporting new technologies as they become available and can be applied to a variety of networks and intelligent scenarios. It is also capable of supporting the development of fully intelligent systems, making it an ideal choice for the future.



2,068 In Stock


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Unit Price: $12,070.0396
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Pricing (USD)

QTY Unit Price Ext Price
1+ $11,225.1368 $11,225.1368
10+ $11,104.4364 $111,044.3643
100+ $10,500.9345 $1,050,093.4452
1000+ $9,897.4325 $4,948,716.2360
10000+ $9,052.5297 $9,052,529.7000
The price is for reference only, please refer to the actual quotation!

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