
Intel Corporation
10AX057H3F34I2LG
10AX057H3F34I2LG ECAD Model
10AX057H3F34I2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 492 | |
Number of Outputs | 492 | |
Number of Logic Cells | 570000 | |
Number of CLBs | 21708 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 21708 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 |
10AX057H3F34I2LG Datasheet Download
10AX057H3F34I2LG Overview
The chip model 10AX057H3F34I2LG is a cutting-edge semiconductor technology developed by a leading chip manufacturer. It is designed to power a variety of applications, from high-performance computing to embedded systems. The chip model is capable of delivering high performance, low power consumption, and high reliability. It also supports a wide range of digital and analog I/O, as well as integrated memory and storage.
As the industry trends in chip model 10AX057H3F34I2LG continue to evolve, it is expected that the demand for this model will continue to grow in the future. This is due to the chip's ability to provide high-performance computing, low power consumption, and high reliability. Additionally, the chip model is designed to be compatible with a variety of applications and is capable of supporting new technologies as they become available.
The chip model 10AX057H3F34I2LG can be applied to a variety of networks, from wireless networks to industrial networks. It can also be used in intelligent scenarios, such as autonomous vehicles, smart homes, and industrial automation. The chip model is also capable of supporting the development of fully intelligent systems, such as artificial intelligence, machine learning, and robotics.
In conclusion, the chip model 10AX057H3F34I2LG is a cutting-edge semiconductor technology that is capable of powering a variety of applications. It is expected to be in high demand in the future due to its ability to provide high performance, low power consumption, and high reliability. Additionally, the chip model is capable of supporting new technologies as they become available and can be applied to a variety of networks and intelligent scenarios. It is also capable of supporting the development of fully intelligent systems, making it an ideal choice for the future.
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2,068 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $11,225.1368 | $11,225.1368 |
10+ | $11,104.4364 | $111,044.3643 |
100+ | $10,500.9345 | $1,050,093.4452 |
1000+ | $9,897.4325 | $4,948,716.2360 |
10000+ | $9,052.5297 | $9,052,529.7000 |
The price is for reference only, please refer to the actual quotation! |