Intel Corporation
10AX057H3F34E2LG
10AX057H3F34E2LG ECAD Model
10AX057H3F34E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 570000 | |
| Number of CLBs | 21708 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 21708 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX057H3F34E2LG Datasheet Download
10AX057H3F34E2LG Overview
The chip model 10AX057H3F34E2LG has been gaining traction in the industry due to its impressive performance and features. It is a highly advanced chip that has been specifically designed to meet the needs of the modern digital world. It is capable of providing high-speed and reliable data transmission, and has a wide range of applications, from industrial automation to consumer electronics.
In terms of industry trends, the chip model 10AX057H3F34E2LG is expected to be widely adopted in the near future. It is a highly cost-effective solution for businesses, as it is compatible with a variety of existing technologies and can be easily integrated into existing systems. Furthermore, the chip is capable of supporting the latest technologies, such as 5G, artificial intelligence (AI), and the Internet of Things (IoT). This makes it an ideal choice for businesses looking to stay ahead of the curve in terms of technology.
The chip model 10AX057H3F34E2LG is also suitable for a variety of intelligent scenarios. It is capable of providing high-speed data transmission, as well as being able to process large amounts of data quickly and accurately. This makes it an ideal choice for applications such as autonomous driving, intelligent transportation systems, and intelligent surveillance systems. Moreover, the chip can be used in the era of fully intelligent systems, as it is capable of supporting the latest technologies such as AI and IoT.
In terms of product description and design requirements, the chip model 10AX057H3F34E2LG is a highly advanced chip that has been specifically designed for the modern digital world. It is capable of providing high-speed and reliable data transmission, and has a wide range of applications, from industrial automation to consumer electronics. Furthermore, the chip is capable of supporting the latest technologies, such as 5G, AI, and IoT. It is also suitable for a variety of intelligent scenarios, and can be used in the era of fully intelligent systems.
When it comes to actual case studies and precautions, it is important to note that the chip model 10AX057H3F34E2LG is highly advanced and requires specific design and installation requirements. It is also important to ensure that the chip is properly configured and tested before being used in production. Additionally, it is important to keep in mind that the chip is designed to be used in specific applications and may not be suitable for all scenarios.
In conclusion, the chip model 10AX057H3F34E2LG is a highly advanced chip that is capable of providing high-speed and reliable data transmission, and has a wide range of applications. It is expected to be widely adopted in the near future due to its impressive performance and features, and is capable of supporting the latest technologies such as 5G, AI, and IoT. Furthermore, it is suitable for a variety of intelligent scenarios, and can be used in the era of fully intelligent systems. However, it is important to note that the chip is highly advanced and requires specific design and installation requirements, and should be properly configured and tested before being used in production.
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4,327 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $10,995.2108 | $10,995.2108 |
| 10+ | $10,876.9827 | $108,769.8272 |
| 100+ | $10,285.8424 | $1,028,584.2351 |
| 1000+ | $9,694.7020 | $4,847,350.9930 |
| 10000+ | $8,867.1055 | $8,867,105.4750 |
| The price is for reference only, please refer to the actual quotation! | ||