10AX057H2F34I2SG
10AX057H2F34I2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX057H2F34I2SG


10AX057H2F34I2SG
F18-10AX057H2F34I2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX057H2F34I2SG ECAD Model


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10AX057H2F34I2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 492
Number of Outputs 492
Number of Logic Cells 570000
Number of CLBs 21708
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 21708 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX057H2F34I2SG Datasheet Download


10AX057H2F34I2SG Overview



The chip model 10AX057H2F34I2SG is a new product from a leading semiconductor manufacturer. It is designed to meet the needs of the latest applications in the communication system industry. It is a high-performance, low-cost chip that offers both flexibility and scalability.


The 10AX057H2F34I2SG is a multi-core processor that is designed to support multiple communication protocols. It is designed to be able to handle a variety of applications with different requirements. It can be used in both wired and wireless communication systems. It is also designed to be able to handle high-speed data transfer and low-power operation.


The product description of the 10AX057H2F34I2SG chip includes the following features:


• Multi-core architecture

• High-performance processor

• Low power consumption

• Flexible and scalable design

• Support for multiple communication protocols

• Support for high-speed data transfer

• Support for low-power operation


The 10AX057H2F34I2SG chip is designed to meet the needs of advanced communication systems. It is a versatile chip that is capable of handling a wide range of applications. It is also designed to be able to handle high-speed data transfer and low-power operation.


In terms of industry trends, the 10AX057H2F34I2SG chip is expected to be the preferred choice for many communication system applications. It is a highly versatile chip that is capable of handling a variety of applications. It is also designed to be able to handle high-speed data transfer and low-power operation.


In terms of future development, the 10AX057H2F34I2SG chip is expected to be the preferred choice for many communication system applications. It is designed to be able to handle a variety of applications with different requirements. It is also designed to be able to handle high-speed data transfer and low-power operation.


In terms of whether the application environment requires the support of new technologies, it depends on what specific technologies are needed. The 10AX057H2F34I2SG chip is designed to be able to handle a variety of applications with different requirements. It is also designed to be able to handle high-speed data transfer and low-power operation.


In terms of the original design intention of the 10AX057H2F34I2SG chip and the possibility of future upgrades, the 10AX057H2F34I2SG chip is designed to be able to handle a variety of applications with different requirements. It is also designed to be able to handle high-speed data transfer and low-power operation. It is expected to be the preferred choice for many communication system applications.


In terms of actual case studies and precautions, the 10AX057H2F34I2SG chip is designed to be able to handle a variety of applications with different requirements. It is also designed to be able to handle high-speed data transfer and low-power operation. It is expected to be the preferred choice for many communication system applications. It is important to ensure that the chip is properly configured and that the necessary precautions are taken to ensure that the chip is able to operate properly.



5,178 In Stock


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Unit Price: $10,537.1826
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $9,799.5798 $9,799.5798
10+ $9,694.2080 $96,942.0799
100+ $9,167.3489 $916,734.8862
1000+ $8,640.4897 $4,320,244.8660
10000+ $7,902.8870 $7,902,886.9500
The price is for reference only, please refer to the actual quotation!

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