
Intel Corporation
10AX057H2F34I2SG
10AX057H2F34I2SG ECAD Model
10AX057H2F34I2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 492 | |
Number of Outputs | 492 | |
Number of Logic Cells | 570000 | |
Number of CLBs | 21708 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 21708 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX057H2F34I2SG Datasheet Download
10AX057H2F34I2SG Overview
The chip model 10AX057H2F34I2SG is a new product from a leading semiconductor manufacturer. It is designed to meet the needs of the latest applications in the communication system industry. It is a high-performance, low-cost chip that offers both flexibility and scalability.
The 10AX057H2F34I2SG is a multi-core processor that is designed to support multiple communication protocols. It is designed to be able to handle a variety of applications with different requirements. It can be used in both wired and wireless communication systems. It is also designed to be able to handle high-speed data transfer and low-power operation.
The product description of the 10AX057H2F34I2SG chip includes the following features:
• Multi-core architecture
• High-performance processor
• Low power consumption
• Flexible and scalable design
• Support for multiple communication protocols
• Support for high-speed data transfer
• Support for low-power operation
The 10AX057H2F34I2SG chip is designed to meet the needs of advanced communication systems. It is a versatile chip that is capable of handling a wide range of applications. It is also designed to be able to handle high-speed data transfer and low-power operation.
In terms of industry trends, the 10AX057H2F34I2SG chip is expected to be the preferred choice for many communication system applications. It is a highly versatile chip that is capable of handling a variety of applications. It is also designed to be able to handle high-speed data transfer and low-power operation.
In terms of future development, the 10AX057H2F34I2SG chip is expected to be the preferred choice for many communication system applications. It is designed to be able to handle a variety of applications with different requirements. It is also designed to be able to handle high-speed data transfer and low-power operation.
In terms of whether the application environment requires the support of new technologies, it depends on what specific technologies are needed. The 10AX057H2F34I2SG chip is designed to be able to handle a variety of applications with different requirements. It is also designed to be able to handle high-speed data transfer and low-power operation.
In terms of the original design intention of the 10AX057H2F34I2SG chip and the possibility of future upgrades, the 10AX057H2F34I2SG chip is designed to be able to handle a variety of applications with different requirements. It is also designed to be able to handle high-speed data transfer and low-power operation. It is expected to be the preferred choice for many communication system applications.
In terms of actual case studies and precautions, the 10AX057H2F34I2SG chip is designed to be able to handle a variety of applications with different requirements. It is also designed to be able to handle high-speed data transfer and low-power operation. It is expected to be the preferred choice for many communication system applications. It is important to ensure that the chip is properly configured and that the necessary precautions are taken to ensure that the chip is able to operate properly.
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5,178 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $9,799.5798 | $9,799.5798 |
10+ | $9,694.2080 | $96,942.0799 |
100+ | $9,167.3489 | $916,734.8862 |
1000+ | $8,640.4897 | $4,320,244.8660 |
10000+ | $7,902.8870 | $7,902,886.9500 |
The price is for reference only, please refer to the actual quotation! |