Intel Corporation
10AX048K4F35I3SG
10AX048K4F35I3SG ECAD Model
10AX048K4F35I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 396 | |
| Number of Outputs | 396 | |
| Number of Logic Cells | 480000 | |
| Number of CLBs | 18359 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 18359 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048K4F35I3SG Datasheet Download
10AX048K4F35I3SG Overview
The chip model 10AX048K4F35I3SG is a product of great importance in the semiconductor industry. It is a 10-nanometer advanced processor designed by a leading semiconductor company, and it is widely used in many different industries, ranging from consumer electronics to automotive and communication systems. The model is designed to provide customers with improved performance and energy efficiency compared to previous generations, and it features a wide range of features such as high-speed processing and low-power consumption.
The chip model 10AX048K4F35I3SG is expected to have a positive impact on the development of related industries in the future. It has the potential to provide customers with improved performance and energy efficiency, as well as increased flexibility in terms of product design. This means that the model can be used in a variety of different applications, from consumer electronics to automotive and communication systems. Furthermore, the model has the potential to be upgraded in the future, allowing for more advanced features and capabilities.
In terms of the application environment, the chip model 10AX048K4F35I3SG is designed to provide customers with the best performance and energy efficiency. Its advanced design allows for the support of new technologies, such as the latest communication protocols and architectures. This means that the model is suitable for use in advanced communication systems, and it can be used to provide customers with improved performance and energy efficiency.
The chip model 10AX048K4F35I3SG has been designed with the intention of providing customers with improved performance and energy efficiency. It is expected to have a significant impact on the development of related industries in the future, and it has the potential to be upgraded in the future. Furthermore, its advanced design allows for the support of new technologies, meaning that it can be used in advanced communication systems. As such, the chip model 10AX048K4F35I3SG is an important product in the semiconductor industry, and its potential impact on related industries should not be underestimated.
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3,178 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,680.5467 | $7,680.5467 |
| 10+ | $7,597.9602 | $75,979.6021 |
| 100+ | $7,185.0276 | $718,502.7588 |
| 1000+ | $6,772.0950 | $3,386,047.4840 |
| 10000+ | $6,193.9893 | $6,193,989.3000 |
| The price is for reference only, please refer to the actual quotation! | ||