Intel Corporation
10AX048K3F35E2SG
10AX048K3F35E2SG ECAD Model
10AX048K3F35E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 396 | |
| Number of Outputs | 396 | |
| Number of Logic Cells | 480000 | |
| Number of CLBs | 18359 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 18359 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048K3F35E2SG Datasheet Download
10AX048K3F35E2SG Overview
Chip model 10AX048K3F35E2SG is one of the latest and most advanced models in the semiconductor industry. It is a highly integrated, low-power and high-performance chip, designed to meet the needs of various industries. This model is a revolutionary breakthrough in the semiconductor industry, as it combines the advantages of both traditional and advanced technologies.
The main advantages of the chip model 10AX048K3F35E2SG are its low power consumption, high performance, and its compatibility with various communication systems. Its low power consumption makes it ideal for applications that require minimal power consumption, such as mobile devices and IoT devices. Its high performance makes it suitable for applications that require high performance, such as artificial intelligence and data processing. Its compatibility with various communication systems makes it ideal for applications that require multiple communication protocols, such as 5G and Wi-Fi.
The original design intention of the chip model 10AX048K3F35E2SG was to provide a low-power and high-performance chip for various industries. It was designed to meet the needs of various industries, including mobile devices, IoT devices, artificial intelligence, data processing, and communication systems. The chip model was designed to provide a low-power and high-performance solution for these industries.
The future demand for the chip model 10AX048K3F35E2SG is expected to be high, as the chip is designed to meet the needs of various industries. As more and more industries are adopting the chip model, the demand for the model is expected to continue to grow. The chip model is also expected to be used in more advanced communication systems, such as 5G and Wi-Fi, as these systems become more popular.
The product description and specific design requirements of the chip model 10AX048K3F35E2SG are as follows: it is a highly integrated, low-power and high-performance chip, designed to meet the needs of various industries. It has a low power consumption, high performance, and compatibility with various communication systems. It is designed to provide a low-power and high-performance solution for various industries.
Actual case studies and precautions should also be taken into consideration when using the chip model 10AX048K3F35E2SG. It is important to ensure that the chip is compatible with the specific application that it is being used for. It is also important to ensure that the chip is properly installed and configured, as improper installation or configuration can lead to problems. Additionally, the chip should be tested thoroughly before it is deployed in a production environment.
In conclusion, the chip model 10AX048K3F35E2SG is an advanced and highly integrated chip, designed to meet the needs of various industries. It has a low power consumption, high performance, and compatibility with various communication systems. The future demand for the chip model is expected to be high, as more and more industries are adopting the chip model. It is important to ensure that the chip is properly installed and configured, as improper installation or configuration can lead to problems. Additionally, the chip should be tested thoroughly before it is deployed in a production environment.
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5,417 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,447.2746 | $8,447.2746 |
| 10+ | $8,356.4437 | $83,564.4372 |
| 100+ | $7,902.2892 | $790,228.9170 |
| 1000+ | $7,448.1346 | $3,724,067.3100 |
| 10000+ | $6,812.3183 | $6,812,318.2500 |
| The price is for reference only, please refer to the actual quotation! | ||