Intel Corporation
10AX048K2F35E2LG
10AX048K2F35E2LG ECAD Model
10AX048K2F35E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 396 | |
| Number of Outputs | 396 | |
| Number of Logic Cells | 480000 | |
| Number of CLBs | 18359 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 18359 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048K2F35E2LG Datasheet Download
10AX048K2F35E2LG Overview
The chip model 10AX048K2F35E2LG is a high-performance, low-power integrated circuit (IC) designed for use in advanced communication systems. It is one of the most advanced chips available today, and it offers a range of features that make it suitable for applications in a variety of industries.
The 10AX048K2F35E2LG is designed to provide a high level of integration, allowing for the efficient use of space and power. It features a range of features including a high-speed processor, a large memory capacity, and a range of peripheral interfaces. The chip also offers a range of power management features, allowing for efficient power management in a variety of applications.
The 10AX048K2F35E2LG is designed to be highly reliable and durable. It is designed to withstand a range of environmental conditions, including temperature extremes, humidity, and vibration. The chip is also designed to be resistant to electrical noise, allowing for reliable operation in a variety of environments.
The chip model 10AX048K2F35E2LG is designed to be compatible with a range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. This allows the chip to be used in a variety of applications, including industrial, consumer, and automotive applications. The chip is also designed to be compatible with a range of operating systems, including Windows, Linux, and Android.
The chip model 10AX048K2F35E2LG is designed to be highly scalable, allowing for the development of new features and applications as the industry evolves. This allows the chip to remain relevant in the future, as new technologies and applications become available. The chip is also designed to be upgradeable, allowing for the addition of new features and capabilities as they become available.
In terms of industry trends, the 10AX048K2F35E2LG is expected to remain popular in a variety of industries, including industrial, consumer, and automotive applications. The chip is expected to remain in high demand due to its scalability and upgradeability, as well as its compatibility with a range of communication protocols and operating systems.
In terms of future development, the 10AX048K2F35E2LG is expected to remain popular in a variety of applications. The chip is likely to be used in a range of applications, including industrial, consumer, and automotive applications. It is also likely to be used in a range of advanced communication systems, as the chip is designed to be compatible with a range of communication protocols.
The 10AX048K2F35E2LG is a highly reliable and durable chip, designed to be compatible with a range of communication protocols and operating systems. It is also highly scalable and upgradeable, allowing for the development of new features and applications as the industry evolves. As a result, the chip model 10AX048K2F35E2LG is expected to remain popular in a variety of industries, and to remain relevant in the future.
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3,739 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $11,521.5763 | $11,521.5763 |
| 10+ | $11,397.6884 | $113,976.8836 |
| 100+ | $10,778.2488 | $1,077,824.8779 |
| 1000+ | $10,158.8092 | $5,079,404.5970 |
| 10000+ | $9,291.5938 | $9,291,593.7750 |
| The price is for reference only, please refer to the actual quotation! | ||