Intel Corporation
10AX048K1F35E1SG
10AX048K1F35E1SG ECAD Model
10AX048K1F35E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 396 | |
| Number of Outputs | 396 | |
| Number of Logic Cells | 480000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048K1F35E1SG Overview
The chip model 10AX048K1F35E1SG is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It has been widely used in the industry to meet the ever-changing needs of the digital world.
The chip model 10AX048K1F35E1SG is designed to provide a high degree of flexibility and scalability, allowing it to be used in a variety of applications. Its original design intention was to provide a powerful and reliable platform for advanced digital signal processing and embedded processing applications. The chip model is also capable of supporting a variety of communication systems, such as those used in the medical and automotive industries.
In terms of industry trends, the chip model 10AX048K1F35E1SG is expected to remain a popular choice for many applications. As technology advances, it is likely that the chip model will be upgraded to support new technologies, such as 5G networks and artificial intelligence. This will enable the chip model to remain a competitive choice for companies looking for a reliable and powerful platform for their digital applications.
In terms of future upgrades, the chip model 10AX048K1F35E1SG is designed to be highly upgradable. This means that it can be easily adapted to support new technologies and applications as they become available. This will ensure that the chip model remains a reliable choice for companies looking for a powerful and reliable platform for their digital applications.
Overall, the chip model 10AX048K1F35E1SG is a powerful and reliable integrated circuit designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to provide a high degree of flexibility and scalability, allowing it to be used in a variety of applications. As technology advances, it is likely that the chip model will be upgraded to support new technologies, ensuring that it remains a competitive choice for companies looking for a reliable and powerful platform for their digital applications.
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3,270 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||