
Intel Corporation
10AX048H3F34I2SG
10AX048H3F34I2SG ECAD Model
10AX048H3F34I2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 492 | |
Number of Outputs | 492 | |
Number of Logic Cells | 480000 | |
Number of CLBs | 18359 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 18359 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX048H3F34I2SG Datasheet Download
10AX048H3F34I2SG Overview
The chip model 10AX048H3F34I2SG is an advanced semiconductor technology that has been developed to meet the growing needs of modern applications. It is designed to provide high performance and reliability, while also being cost-effective. This model is ideal for applications that require a wide range of capabilities, such as controlling industrial robots, medical equipment, and aerospace systems.
The 10AX048H3F34I2SG chip model has several advantages over other models. It is equipped with a wide range of features, including a high-speed processor, a large memory capacity, and an integrated power management system. Additionally, it is designed to be energy-efficient, allowing for a longer battery life in portable applications.
The 10AX048H3F34I2SG chip model is expected to become increasingly popular in the coming years, as it is well-suited to the needs of modern applications. It is likely to be used in a variety of industries, including automotive, medical, and aerospace. Furthermore, its use in the development of intelligent robots is likely to increase, as it is capable of providing the necessary capabilities to control them.
In order to effectively use the 10AX048H3F34I2SG chip model, a variety of technical talents are needed. These include engineers with knowledge of semiconductor technology, software developers, and roboticists. Additionally, the application environment may require the support of new technologies, such as artificial intelligence, machine learning, and natural language processing.
In conclusion, the 10AX048H3F34I2SG chip model is a powerful and reliable semiconductor technology that is suitable for a wide range of modern applications. It is likely to become increasingly popular in the coming years, and its use in the development of intelligent robots is likely to increase. To effectively use this model, a variety of technical talents are needed, and the application environment may require the support of new technologies.
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1,703 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $7,755.2724 | $7,755.2724 |
10+ | $7,671.8824 | $76,718.8239 |
100+ | $7,254.9323 | $725,493.2262 |
1000+ | $6,837.9821 | $3,418,991.0660 |
10000+ | $6,254.2520 | $6,254,251.9500 |
The price is for reference only, please refer to the actual quotation! |