Intel Corporation
10AX048H2F34I2LG
10AX048H2F34I2LG ECAD Model
10AX048H2F34I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 492 | |
| Number of Outputs | 492 | |
| Number of Logic Cells | 480000 | |
| Number of CLBs | 18359 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 18359 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048H2F34I2LG Datasheet Download
10AX048H2F34I2LG Overview
The chip model 10AX048H2F34I2LG is a powerful and versatile chip that is suitable for a variety of applications. It is designed to support high-performance digital signal processing, embedded processing, and image processing. The chip is programmed using a hardware description language (HDL) and offers a range of advantages for users.
The chip model 10AX048H2F34I2LG is designed to be power-efficient and can be used for a variety of applications. It is also designed to be reliable and robust, making it a great choice for embedded systems. The chip is also designed to be highly scalable, meaning that it can easily be adapted to different applications. This makes it an ideal choice for a wide range of applications.
The chip model 10AX048H2F34I2LG is expected to be in high demand in the future, as more and more applications require high-performance digital signal processing, embedded processing, and image processing. This chip is also expected to be used in networks and intelligent scenarios, as it is designed to be power-efficient and reliable. In addition, it is also expected to be used in the era of fully intelligent systems, as it is designed to be highly scalable and can easily be adapted to different applications.
The chip model 10AX048H2F34I2LG is an ideal choice for a wide range of applications, as it is designed to be power-efficient, reliable, and highly scalable. It is expected to be in high demand in the future, as more and more applications require high-performance digital signal processing, embedded processing, and image processing. It is also expected to be used in networks and intelligent scenarios, as well as in the era of fully intelligent systems.
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4,701 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $10,575.3959 | $10,575.3959 |
| 10+ | $10,461.6819 | $104,616.8193 |
| 100+ | $9,893.1123 | $989,311.2258 |
| 1000+ | $9,324.5426 | $4,662,271.2940 |
| 10000+ | $8,528.5451 | $8,528,545.0500 |
| The price is for reference only, please refer to the actual quotation! | ||