Intel Corporation
10AX048E3F29I2SG
10AX048E3F29I2SG ECAD Model
10AX048E3F29I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 480000 | |
| Number of CLBs | 18359 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 18359 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048E3F29I2SG Datasheet Download
10AX048E3F29I2SG Overview
The chip model 10AX048E3F29I2SG is a cutting-edge chip model developed by a leading semiconductor manufacturer. It is a low-power, high-performance, multi-function chip model that can be used in a variety of different applications. Its features include a high-speed data transfer rate, low power consumption, and a wide operating temperature range.
The 10AX048E3F29I2SG chip model has several advantages over other chip models. Its low power consumption makes it ideal for use in applications that require long battery life, while its high-speed data transfer rate makes it suitable for applications that require data to be transferred quickly, such as in communication systems. Additionally, its wide operating temperature range makes it suitable for use in a variety of different climates.
The 10AX048E3F29I2SG chip model is expected to be in high demand in the future. As the demand for faster and more efficient communication systems grows, the 10AX048E3F29I2SG chip model is expected to be used more frequently. Additionally, with the increasing development and use of intelligent robots, the 10AX048E3F29I2SG chip model is expected to be used for their development and popularization.
The original design intention of the 10AX048E3F29I2SG chip model was to provide a high-performance, low-power, multi-function chip model that could be used in a variety of different applications. The possibility of future upgrades to the chip model is likely, as the demand for faster and more efficient communication systems continues to increase. Additionally, the 10AX048E3F29I2SG chip model is suitable for use in the development and popularization of future intelligent robots.
In order to use the 10AX048E3F29I2SG chip model effectively, it is important that the user has a good understanding of the chip model and its features. Technical knowledge of communication systems and robotics is also necessary in order to use the 10AX048E3F29I2SG chip model to its full potential. Additionally, the user should have a good understanding of the chip model’s specifications in order to ensure that it is used correctly.
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5,601 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,494.6711 | $6,494.6711 |
| 10+ | $6,424.8359 | $64,248.3592 |
| 100+ | $6,075.6601 | $607,566.0051 |
| 1000+ | $5,726.4842 | $2,863,242.0930 |
| 10000+ | $5,237.6380 | $5,237,637.9750 |
| The price is for reference only, please refer to the actual quotation! | ||