Intel Corporation
10AX048E2F29I1HG
10AX048E2F29I1HG ECAD Model
10AX048E2F29I1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 480000 | |
| Number of CLBs | 18359 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 18359 CLBS | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048E2F29I1HG Datasheet Download
10AX048E2F29I1HG Overview
The chip model 10AX048E2F29I1HG is a powerful and advanced integrated circuit developed by the leading semiconductor company. It is designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is based on the latest HDL language and can be used in a wide range of applications.
The original design intention of the chip model 10AX048E2F29I1HG is to provide a powerful, yet efficient platform for digital signal processing, embedded processing, image processing, and other applications. This chip model is designed to be highly efficient and reliable, while also providing a great deal of flexibility and scalability. It is also designed to be easily upgradable, allowing users to add new features and capabilities as needed.
The chip model 10AX048E2F29I1HG is also suitable for advanced communication systems. This chip model is designed to support the latest communication protocols, allowing for faster data transmission and more reliable connections. It is also designed to be compatible with a range of communication devices, allowing for greater flexibility in the development of communication systems.
The chip model 10AX048E2F29I1HG can be applied to the development and popularization of future intelligent robots. This chip model is designed to provide the necessary computing power and intelligence for robots to be able to interact with their environment and carry out complex tasks. It is also designed to be compatible with a range of sensors, allowing robots to be able to detect and respond to their environment.
In order to use the chip model 10AX048E2F29I1HG effectively, it is important to have a good understanding of the HDL language and the underlying principles of digital signal processing, embedded processing, and image processing. It is also important to have a good understanding of the communication protocols used in advanced communication systems. Additionally, it is important to have a good understanding of the principles of machine learning and artificial intelligence, as these are essential for the development and popularization of future intelligent robots.
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1,416 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $8,096.4292 | $8,096.4292 |
| 10+ | $8,009.3709 | $80,093.7087 |
| 100+ | $7,574.0790 | $757,407.8973 |
| 1000+ | $7,138.7871 | $3,569,393.5390 |
| 10000+ | $6,529.3784 | $6,529,378.4250 |
| The price is for reference only, please refer to the actual quotation! | ||