Intel Corporation
10AX048E2F29E2LG
10AX048E2F29E2LG ECAD Model
10AX048E2F29E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 480000 | |
| Number of CLBs | 18359 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 18359 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048E2F29E2LG Datasheet Download
10AX048E2F29E2LG Overview
The chip model 10AX048E2F29E2LG is a cutting-edge chip that has been developed to meet the ever-growing demand for more powerful, efficient, and reliable components for a range of applications. It is a versatile chip that can be used in a variety of scenarios, from communications to networks and intelligent systems.
As the world moves towards an increasingly connected and intelligent future, the chip model 10AX048E2F29E2LG is designed to keep up with the latest industry trends. It is built with the latest technologies, such as artificial intelligence, machine learning, and big data, to provide a powerful and reliable platform for future applications.
The chip model 10AX048E2F29E2LG is designed to be upgradable and compatible with future technologies, so it can be used in more advanced communication systems. It is also capable of being applied to intelligent scenarios, such as autonomous vehicles, smart cities, and the Internet of Things. This makes it an ideal choice for applications that require advanced features and robust performance.
The chip model 10AX048E2F29E2LG is designed to be future-proof and can be used in the era of fully intelligent systems. It is designed to be compatible with the latest technologies, such as 5G, Wi-Fi 6, and 6LoWPAN, so it can be used in the most demanding of networks. This makes the chip model 10AX048E2F29E2LG an ideal choice for a range of applications, from communications to networks and intelligent systems.
In conclusion, the chip model 10AX048E2F29E2LG is a cutting-edge chip that has been designed to meet the ever-growing demand for more powerful, efficient, and reliable components for a range of applications. It is built with the latest technologies, such as artificial intelligence, machine learning, and big data, and is designed to be upgradable and compatible with future technologies. This makes it an ideal choice for applications that require advanced features and robust performance, from communications to networks and intelligent systems.
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2,415 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $7,589.5755 | $7,589.5755 |
| 10+ | $7,507.9672 | $75,079.6719 |
| 100+ | $7,099.9255 | $709,992.5493 |
| 1000+ | $6,691.8838 | $3,345,941.8990 |
| 10000+ | $6,120.6254 | $6,120,625.4250 |
| The price is for reference only, please refer to the actual quotation! | ||