Intel Corporation
10AX048E1F29E1SG
10AX048E1F29E1SG ECAD Model
10AX048E1F29E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 480000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX048E1F29E1SG Overview
The chip model 10AX048E1F29E1SG is a product of advanced technology developed by the chip manufacturer, designed to meet the needs of the most demanding applications. With its high-performance processing capabilities, this chip model can be used in a variety of communication systems, as well as in the development and popularization of future intelligent robots.
The original design intention of this chip model was to provide a high-performance solution for advanced communication systems, while also allowing for easy upgrades to meet future needs. The chip model is designed to provide a powerful, yet flexible solution for a variety of applications. It is equipped with an advanced architecture, which provides a high level of performance and scalability. It also features a wide range of features, including support for multiple communication protocols, high-speed data transfer, and a wide range of customization options.
The product description and specific design requirements of the chip model 10AX048E1F29E1SG are detailed in the product manual. It provides a comprehensive overview of the chip model, including its features, specifications, and design considerations. Additionally, the manual includes actual case studies and precautions, which should be followed when using the chip model.
In order to use the chip model 10AX048E1F29E1SG effectively, there are certain technical talents that are needed. This includes knowledge of the chip model's architecture, as well as knowledge of the various communication protocols that it supports. Additionally, knowledge of the various customization options available is also important. Finally, experience in designing and developing applications for the chip model is also essential.
Overall, the chip model 10AX048E1F29E1SG is a powerful and flexible solution for advanced communication systems. It is designed to provide a high-performance solution, while also allowing for easy upgrades to meet future needs. Additionally, it can be used in the development and popularization of future intelligent robots, provided that the correct technical talents are utilized.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||