Intel Corporation
10AX032H4F35I3SG
10AX032H4F35I3SG ECAD Model
10AX032H4F35I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX032H4F35I3SG Datasheet Download
10AX032H4F35I3SG Overview
The chip model 10AX032H4F35I3SG is an integrated circuit (IC) designed for advanced communication systems. It is a powerful tool to help optimize signal processing, reduce power consumption and increase system performance. It is designed to meet the needs of the most demanding communication applications.
The 10AX032H4F35I3SG chip is a low-power, high-performance device that is designed to support the latest communication protocols. It is designed to support high-speed data transmission, and is capable of supporting multiple communication protocols, including Ethernet, USB, and Wi-Fi. It also supports advanced signal processing algorithms and is capable of providing high-quality signal processing results.
The 10AX032H4F35I3SG chip is designed to meet the requirements of the most demanding communication applications. It is designed to be highly reliable and provide high performance. It is also designed to be power efficient and reduce the power consumption of the system. It is also designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols.
The 10AX032H4F35I3SG chip is designed to meet the requirements of the most advanced communication systems. It is designed to be highly reliable and provide high performance. It is also designed to be power efficient and reduce the power consumption of the system. It is also designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols.
The 10AX032H4F35I3SG chip is designed to be highly reliable and provide high performance. It is also designed to be power efficient and reduce the power consumption of the system. It is also designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols. It is also designed to be upgradable so that it can be used in the future with new technologies.
In terms of industry trends, the 10AX032H4F35I3SG chip is designed to be used in advanced communication systems. It is designed to be highly reliable and provide high performance. It is also designed to be power efficient and reduce the power consumption of the system. It is also designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols.
In terms of future development, the 10AX032H4F35I3SG chip is designed to be upgradable so that it can be used in the future with new technologies. It is also designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols. This chip is designed to meet the requirements of the most advanced communication systems and is designed to be highly reliable and provide high performance.
In terms of application environment, the 10AX032H4F35I3SG chip is designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols. It is also designed to be upgradable so that it can be used in the future with new technologies.
In terms of product description and design requirements, the 10AX032H4F35I3SG chip is designed to meet the requirements of the most advanced communication systems. It is designed to be highly reliable and provide high performance. It is also designed to be power efficient and reduce the power consumption of the system. It is also designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols.
In terms of actual case studies and precautions, the 10AX032H4F35I3SG chip is designed to meet the requirements of the most advanced communication systems. It is designed to be highly reliable and provide high performance. It is also designed to be power efficient and reduce the power consumption of the system. It is also designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols. It is also designed to be upgradable so that it can be used in the future with new technologies. In addition, it is important to consider the specific design requirements and actual case studies when using this chip.
In conclusion, the 10AX032H4F35I3SG chip is a powerful tool to help optimize signal processing, reduce power consumption and increase system performance. It is designed to meet the needs of the most demanding communication applications and is designed to be highly reliable and provide high performance. It is also designed to be power efficient and reduce the power consumption of the system. It is also designed to be compatible with a wide range of communication protocols and is capable of supporting multiple protocols. It is also designed to be upgradable so that it can be used in the future with new technologies. It is important to consider the specific design requirements and actual case studies when using this chip.
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5,941 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,960.4896 | $3,960.4896 |
| 10+ | $3,917.9037 | $39,179.0372 |
| 100+ | $3,704.9742 | $370,497.4170 |
| 1000+ | $3,492.0446 | $1,746,022.3100 |
| 10000+ | $3,193.9433 | $3,193,943.2500 |
| The price is for reference only, please refer to the actual quotation! | ||