Intel Corporation
10AX032H4F35E3LG
10AX032H4F35E3LG ECAD Model
10AX032H4F35E3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032H4F35E3LG Datasheet Download
10AX032H4F35E3LG Overview
The chip model 10AX032H4F35E3LG is a high-performance integrated circuit chip designed for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, a hardware description language, allowing for better control and optimization of the chip's performance.
The 10AX032H4F35E3LG is an example of the current industry trend of developing more powerful and efficient integrated circuit chips. It is expected to be used in a variety of applications and provide a high level of performance. As technology advances, the chip can be upgraded and adapted to the changing needs of its users.
The original design intention of the 10AX032H4F35E3LG was to provide a high-performance integrated circuit chip that could be used for digital signal processing, embedded processing, and image processing. The chip is also capable of being used in advanced communication systems, allowing for faster data transfer and more reliable communication.
In the future, the 10AX032H4F35E3LG is expected to be used in a variety of applications and to provide a high level of performance. It is also expected to be compatible with new technologies, allowing for better control and optimization of the chip's performance. Furthermore, it is expected to be upgradeable and adaptable to the changing needs of its users, allowing for easier integration into new applications and systems.
Overall, the 10AX032H4F35E3LG is an example of the current industry trend of developing more powerful and efficient integrated circuit chips. It is designed to provide a high level of performance and to be used in a variety of applications. It is also expected to be compatible with new technologies and upgradeable to meet the changing needs of its users.
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2,686 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,715.9754 | $4,715.9754 |
| 10+ | $4,665.2660 | $46,652.6600 |
| 100+ | $4,411.7189 | $441,171.8931 |
| 1000+ | $4,158.1719 | $2,079,085.9330 |
| 10000+ | $3,803.2060 | $3,803,205.9750 |
| The price is for reference only, please refer to the actual quotation! | ||