10AX032H4F35E3LG
10AX032H4F35E3LG
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rohs

Intel Corporation

10AX032H4F35E3LG


10AX032H4F35E3LG
F18-10AX032H4F35E3LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX032H4F35E3LG ECAD Model


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10AX032H4F35E3LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 384
Number of Outputs 384
Number of Logic Cells 320000
Number of CLBs 11990
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 11990 CLBS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.39.00.01

10AX032H4F35E3LG Datasheet Download


10AX032H4F35E3LG Overview



The chip model 10AX032H4F35E3LG is a high-performance integrated circuit chip designed for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, a hardware description language, allowing for better control and optimization of the chip's performance.


The 10AX032H4F35E3LG is an example of the current industry trend of developing more powerful and efficient integrated circuit chips. It is expected to be used in a variety of applications and provide a high level of performance. As technology advances, the chip can be upgraded and adapted to the changing needs of its users.


The original design intention of the 10AX032H4F35E3LG was to provide a high-performance integrated circuit chip that could be used for digital signal processing, embedded processing, and image processing. The chip is also capable of being used in advanced communication systems, allowing for faster data transfer and more reliable communication.


In the future, the 10AX032H4F35E3LG is expected to be used in a variety of applications and to provide a high level of performance. It is also expected to be compatible with new technologies, allowing for better control and optimization of the chip's performance. Furthermore, it is expected to be upgradeable and adaptable to the changing needs of its users, allowing for easier integration into new applications and systems.


Overall, the 10AX032H4F35E3LG is an example of the current industry trend of developing more powerful and efficient integrated circuit chips. It is designed to provide a high level of performance and to be used in a variety of applications. It is also expected to be compatible with new technologies and upgradeable to meet the changing needs of its users.



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Unit Price: $5,070.9413
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,715.9754 $4,715.9754
10+ $4,665.2660 $46,652.6600
100+ $4,411.7189 $441,171.8931
1000+ $4,158.1719 $2,079,085.9330
10000+ $3,803.2060 $3,803,205.9750
The price is for reference only, please refer to the actual quotation!

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