Intel Corporation
10AX032H4F34I3LG
10AX032H4F34I3LG ECAD Model
10AX032H4F34I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX032H4F34I3LG Datasheet Download
10AX032H4F34I3LG Overview
The chip model 10AX032H4F34I3LG has been gaining increasing attention in recent years. It is suitable for high-performance digital signal processing, embedded processing, image processing, etc. and requires the use of HDL language. This chip model is known for its superior performance and scalability, making it a popular choice for many industries.
The chip model 10AX032H4F34I3LG offers a number of advantages. It is capable of handling complex tasks such as signal processing, image processing, and embedded processing. It also has a high level of scalability, meaning that it can be used in a variety of applications and can be easily upgraded when needed. Furthermore, it is designed to be energy efficient, making it a cost-effective solution for many industries.
Given the increasing demand for the chip model 10AX032H4F34I3LG in the market, it is expected that the demand for this model will continue to grow in the future. As more and more industries are looking for efficient and cost-effective solutions, the chip model 10AX032H4F34I3LG is likely to become even more popular.
The chip model 10AX032H4F34I3LG can be applied to the development and popularization of future intelligent robots. This chip model is capable of handling complex tasks, making it ideal for robots that require advanced capabilities. However, in order to use the model effectively, it is important to have the right technical talents. Professionals who are knowledgeable in HDL language and have experience in embedded processing, signal processing, and image processing are essential for the successful implementation of the chip model 10AX032H4F34I3LG in intelligent robots.
In conclusion, the chip model 10AX032H4F34I3LG is a popular choice for many industries due to its superior performance, scalability, and energy efficiency. The demand for this model is expected to grow in the future, and it can be effectively applied to the development and popularization of future intelligent robots. However, it is important to have the right technical talents in order to use the model effectively.
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4,372 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,659.5636 | $5,659.5636 |
| 10+ | $5,598.7081 | $55,987.0812 |
| 100+ | $5,294.4305 | $529,443.0501 |
| 1000+ | $4,990.1529 | $2,495,076.4430 |
| 10000+ | $4,564.1642 | $4,564,164.2250 |
| The price is for reference only, please refer to the actual quotation! | ||