Intel Corporation
10AX032H4F34E3SG
10AX032H4F34E3SG ECAD Model
10AX032H4F34E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032H4F34E3SG Datasheet Download
10AX032H4F34E3SG Overview
The chip model 10AX032H4F34E3SG is a powerful and versatile processor that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. This processor requires the use of HDL language, which is a hardware description language that allows engineers to design, simulate, and verify complex digital systems.
The 10AX032H4F34E3SG chip model has great potential to be used in a variety of networked applications. It could be used in the development of intelligent systems, such as autonomous vehicles, smart homes, and robotics. It could also be used for communications and data analysis, as well as artificial intelligence and machine learning. This chip could be used in the era of fully intelligent systems, as it has the power and flexibility to handle complex tasks.
The 10AX032H4F34E3SG chip model could also be applied to the development and popularization of future intelligent robots. It could be used to control the robot’s behavior, as well as to process sensory data and enable the robot to interact with its environment. The chip could also be used to enable the robot to learn, adapt, and evolve. To use the 10AX032H4F34E3SG chip model effectively, engineers and software developers with a strong background in HDL language and digital electronics would be needed.
Overall, the 10AX032H4F34E3SG chip model is a powerful and versatile processor that can be used in a variety of applications, including high-performance digital signal processing, embedded processing, image processing, and intelligent systems. With the right technical talent, this chip model could be used to develop and popularize future intelligent robots.
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3,528 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,301.1792 | $3,301.1792 |
| 10+ | $3,265.6826 | $32,656.8260 |
| 100+ | $3,088.1999 | $308,819.9850 |
| 1000+ | $2,910.7171 | $1,455,358.5500 |
| 10000+ | $2,662.2413 | $2,662,241.2500 |
| The price is for reference only, please refer to the actual quotation! | ||