10AX032H3F35I2LG
10AX032H3F35I2LG
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rohs

Intel Corporation

10AX032H3F35I2LG


10AX032H3F35I2LG
F18-10AX032H3F35I2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX032H3F35I2LG ECAD Model


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10AX032H3F35I2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 384
Number of Outputs 384
Number of Logic Cells 320000
Number of CLBs 11990
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 11990 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AX032H3F35I2LG Datasheet Download


10AX032H3F35I2LG Overview



The chip model 10AX032H3F35I2LG is a powerful processor designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of running complex algorithms and processing large amounts of data quickly and efficiently. The model is designed to be used in conjunction with the HDL language, which allows for the development of highly optimized applications.


The original design intention of the 10AX032H3F35I2LG was to provide a highly reliable and powerful processor for digital signal processing, embedded processing, and image processing. It was designed to be able to handle large data sets and complex algorithms quickly and efficiently. The model is also capable of being upgraded and expanded in the future, allowing for more complex applications.


The chip model 10AX032H3F35I2LG has the potential to be used in advanced communication systems, networks, and intelligent scenarios. It is capable of handling large amounts of data quickly and efficiently, making it ideal for applications such as data analytics, machine learning, and artificial intelligence. As the technology advances, the chip model 10AX032H3F35I2LG is likely to be used in the era of fully intelligent systems, allowing for the development of powerful and reliable applications.


In conclusion, the chip model 10AX032H3F35I2LG is a powerful processor designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of running complex algorithms and processing large amounts of data quickly and efficiently. The model is designed to be used in conjunction with the HDL language, allowing for the development of highly optimized applications. It is also capable of being upgraded and expanded in the future, allowing for more complex applications. Furthermore, the chip model 10AX032H3F35I2LG has the potential to be used in advanced communication systems, networks, and intelligent scenarios. As technology advances, the chip model 10AX032H3F35I2LG is likely to be used in the era of fully intelligent systems, allowing for the development of powerful and reliable applications.



5,153 In Stock


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Unit Price: $6,833.3332
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Pricing (USD)

QTY Unit Price Ext Price
1+ $6,354.9999 $6,354.9999
10+ $6,286.6665 $62,866.6654
100+ $5,944.9999 $594,499.9884
1000+ $5,603.3332 $2,801,666.6120
10000+ $5,124.9999 $5,124,999.9000
The price is for reference only, please refer to the actual quotation!

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