
Intel Corporation
10AX032H3F35I2LG
10AX032H3F35I2LG ECAD Model
10AX032H3F35I2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 384 | |
Number of Outputs | 384 | |
Number of Logic Cells | 320000 | |
Number of CLBs | 11990 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 11990 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
10AX032H3F35I2LG Datasheet Download
10AX032H3F35I2LG Overview
The chip model 10AX032H3F35I2LG is a powerful processor designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of running complex algorithms and processing large amounts of data quickly and efficiently. The model is designed to be used in conjunction with the HDL language, which allows for the development of highly optimized applications.
The original design intention of the 10AX032H3F35I2LG was to provide a highly reliable and powerful processor for digital signal processing, embedded processing, and image processing. It was designed to be able to handle large data sets and complex algorithms quickly and efficiently. The model is also capable of being upgraded and expanded in the future, allowing for more complex applications.
The chip model 10AX032H3F35I2LG has the potential to be used in advanced communication systems, networks, and intelligent scenarios. It is capable of handling large amounts of data quickly and efficiently, making it ideal for applications such as data analytics, machine learning, and artificial intelligence. As the technology advances, the chip model 10AX032H3F35I2LG is likely to be used in the era of fully intelligent systems, allowing for the development of powerful and reliable applications.
In conclusion, the chip model 10AX032H3F35I2LG is a powerful processor designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is capable of running complex algorithms and processing large amounts of data quickly and efficiently. The model is designed to be used in conjunction with the HDL language, allowing for the development of highly optimized applications. It is also capable of being upgraded and expanded in the future, allowing for more complex applications. Furthermore, the chip model 10AX032H3F35I2LG has the potential to be used in advanced communication systems, networks, and intelligent scenarios. As technology advances, the chip model 10AX032H3F35I2LG is likely to be used in the era of fully intelligent systems, allowing for the development of powerful and reliable applications.
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5,153 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,354.9999 | $6,354.9999 |
10+ | $6,286.6665 | $62,866.6654 |
100+ | $5,944.9999 | $594,499.9884 |
1000+ | $5,603.3332 | $2,801,666.6120 |
10000+ | $5,124.9999 | $5,124,999.9000 |
The price is for reference only, please refer to the actual quotation! |