Intel Corporation
10AX032H3F35E2SG
10AX032H3F35E2SG ECAD Model
10AX032H3F35E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032H3F35E2SG Datasheet Download
10AX032H3F35E2SG Overview
The chip model 10AX032H3F35E2SG is a product of the semiconductor industry, which is constantly evolving and changing with the times. As the industry progresses, so too does the chip model 10AX032H3F35E2SG, and its potential applications and uses.
The chip model 10AX032H3F35E2SG was designed with the intention of providing a reliable and efficient solution to the communication needs of modern networks. It is capable of supporting a variety of protocols and technologies, making it suitable for a wide range of applications. Its advanced design also allows for future upgrades, allowing it to keep up with the evolving industry trends.
The chip model 10AX032H3F35E2SG is already being used in a variety of networks, from home networks to large enterprise networks. It is also being used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and smart cities. As the industry continues to develop, it is likely that the chip model 10AX032H3F35E2SG will be used in even more advanced applications.
As the industry continues to move towards fully intelligent systems, the chip model 10AX032H3F35E2SG will be required to support new technologies and protocols. It is likely that the chip model 10AX032H3F35E2SG will be able to keep up with these demands, as its advanced design allows for future upgrades.
The chip model 10AX032H3F35E2SG is an impressive product of the semiconductor industry, and its potential applications are only beginning to be realized. As the industry continues to develop, the chip model 10AX032H3F35E2SG will continue to be an important part of the future of networks and intelligent systems. It is likely that the chip model 10AX032H3F35E2SG will continue to be used in a variety of applications, and its future upgrades will ensure that it is able to keep up with the ever-evolving industry trends.
You May Also Be Interested In
1,621 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,979.9564 | $4,979.9564 |
| 10+ | $4,926.4085 | $49,264.0846 |
| 100+ | $4,658.6689 | $465,866.8866 |
| 1000+ | $4,390.9293 | $2,195,464.6380 |
| 10000+ | $4,016.0939 | $4,016,093.8500 |
| The price is for reference only, please refer to the actual quotation! | ||