Intel Corporation
10AX032H3F34E2SG
10AX032H3F34E2SG ECAD Model
10AX032H3F34E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032H3F34E2SG Datasheet Download
10AX032H3F34E2SG Overview
The chip model 10AX032H3F34E2SG is a highly versatile and advanced microcontroller designed by a leading chip manufacturer. It is designed with an integrated ARM Cortex-M3 processor, a wide range of peripherals, and an advanced memory system. This chip model is widely used in a variety of embedded applications such as industrial automation, medical devices, and consumer electronics.
The 10AX032H3F34E2SG is designed to meet the needs of a wide range of applications, from low-power, low-cost systems to high-performance, high-end systems. The chip model features a high level of integration, including a wide range of peripherals, a high-speed memory system, and a wide range of communication protocols. It also provides a wide range of power management capabilities, including power-saving modes and low-power operation.
The 10AX032H3F34E2SG is designed to be highly flexible and is suitable for use in a variety of applications. It is designed to be compatible with a wide range of communication systems, including wired and wireless networks, as well as advanced communication systems such as Bluetooth and Wi-Fi. It also supports a wide range of operating systems, including Linux, Windows, and Android.
The 10AX032H3F34E2SG is designed to be highly reliable and is capable of operating in a wide range of environments. It is designed to be robust and resistant to physical and environmental damage. It is also designed to be highly secure, with features such as secure boot, secure storage, and secure communications.
The 10AX032H3F34E2SG is designed to be highly efficient and energy-efficient. It is designed to be able to operate at low power levels and is capable of reducing power consumption when idle. It is also designed to be highly scalable, with support for upgrades and the ability to be used in advanced communication systems.
The 10AX032H3F34E2SG is a highly versatile and advanced microcontroller designed to meet the needs of a wide range of applications. It is designed to be compatible with a wide range of communication systems, including wired and wireless networks, as well as advanced communication systems such as Bluetooth and Wi-Fi. It is also designed to be highly reliable and secure, with features such as secure boot, secure storage, and secure communications. It is also designed to be highly efficient and energy-efficient, with the ability to operate at low power levels and reduce power consumption when idle. With its wide range of features and capabilities, the 10AX032H3F34E2SG is expected to be in high demand in the future, and it is likely to be a key component in a wide range of advanced communication systems.
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1,411 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,357.1615 | $4,357.1615 |
| 10+ | $4,310.3103 | $43,103.1031 |
| 100+ | $4,076.0543 | $407,605.4313 |
| 1000+ | $3,841.7983 | $1,920,899.1590 |
| 10000+ | $3,513.8399 | $3,513,839.9250 |
| The price is for reference only, please refer to the actual quotation! | ||