10AX032H3F34E2SG
10AX032H3F34E2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX032H3F34E2SG


10AX032H3F34E2SG
F18-10AX032H3F34E2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX032H3F34E2SG ECAD Model


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10AX032H3F34E2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 384
Number of Outputs 384
Number of Logic Cells 320000
Number of CLBs 11990
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 11990 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.39.00.01

10AX032H3F34E2SG Datasheet Download


10AX032H3F34E2SG Overview



The chip model 10AX032H3F34E2SG is a highly versatile and advanced microcontroller designed by a leading chip manufacturer. It is designed with an integrated ARM Cortex-M3 processor, a wide range of peripherals, and an advanced memory system. This chip model is widely used in a variety of embedded applications such as industrial automation, medical devices, and consumer electronics.


The 10AX032H3F34E2SG is designed to meet the needs of a wide range of applications, from low-power, low-cost systems to high-performance, high-end systems. The chip model features a high level of integration, including a wide range of peripherals, a high-speed memory system, and a wide range of communication protocols. It also provides a wide range of power management capabilities, including power-saving modes and low-power operation.


The 10AX032H3F34E2SG is designed to be highly flexible and is suitable for use in a variety of applications. It is designed to be compatible with a wide range of communication systems, including wired and wireless networks, as well as advanced communication systems such as Bluetooth and Wi-Fi. It also supports a wide range of operating systems, including Linux, Windows, and Android.


The 10AX032H3F34E2SG is designed to be highly reliable and is capable of operating in a wide range of environments. It is designed to be robust and resistant to physical and environmental damage. It is also designed to be highly secure, with features such as secure boot, secure storage, and secure communications.


The 10AX032H3F34E2SG is designed to be highly efficient and energy-efficient. It is designed to be able to operate at low power levels and is capable of reducing power consumption when idle. It is also designed to be highly scalable, with support for upgrades and the ability to be used in advanced communication systems.


The 10AX032H3F34E2SG is a highly versatile and advanced microcontroller designed to meet the needs of a wide range of applications. It is designed to be compatible with a wide range of communication systems, including wired and wireless networks, as well as advanced communication systems such as Bluetooth and Wi-Fi. It is also designed to be highly reliable and secure, with features such as secure boot, secure storage, and secure communications. It is also designed to be highly efficient and energy-efficient, with the ability to operate at low power levels and reduce power consumption when idle. With its wide range of features and capabilities, the 10AX032H3F34E2SG is expected to be in high demand in the future, and it is likely to be a key component in a wide range of advanced communication systems.



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Unit Price: $4,685.1199
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,357.1615 $4,357.1615
10+ $4,310.3103 $43,103.1031
100+ $4,076.0543 $407,605.4313
1000+ $3,841.7983 $1,920,899.1590
10000+ $3,513.8399 $3,513,839.9250
The price is for reference only, please refer to the actual quotation!

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