
Intel Corporation
10AX032H2F35I2SG
10AX032H2F35I2SG ECAD Model
10AX032H2F35I2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 384 | |
Number of Outputs | 384 | |
Number of Logic Cells | 320000 | |
Number of CLBs | 11990 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 11990 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 |
10AX032H2F35I2SG Datasheet Download
10AX032H2F35I2SG Overview
The chip model 10AX032H2F35I2SG is a state-of-the-art chip model developed by Intel Corporation. It is a 32-bit processor that is designed to be used in embedded systems and IoT applications. This model is based on the Intel Atom processor architecture and is designed to provide high performance and low power consumption. It also supports a wide range of peripherals and interfaces, making it suitable for a variety of applications.
The 10AX032H2F35I2SG chip model has a number of advantages. It has a low power consumption, making it an ideal choice for applications that require low power consumption. It also has a fast clock frequency and high performance, making it suitable for applications that require high performance. Furthermore, it supports a wide range of peripherals and interfaces, making it suitable for a variety of applications.
The 10AX032H2F35I2SG chip model is expected to be in high demand in a number of industries in the future. It is well suited for applications in the automotive, industrial, and medical industries, as well as for applications in the Internet of Things. It is also expected to be in high demand in the communication and networking industries, as it is capable of supporting advanced communication systems.
The original design intention of the 10AX032H2F35I2SG chip model was to provide a high performance, low power consumption processor for embedded systems and IoT applications. It is also capable of being upgraded in the future to support new technologies. This makes it a good choice for applications that require the support of new technologies, such as advanced communication systems.
In conclusion, the 10AX032H2F35I2SG chip model is an excellent choice for a wide range of applications. It has a low power consumption, a fast clock frequency, and high performance, making it suitable for a variety of applications. It is also expected to be in high demand in a number of industries in the future, and it is capable of being upgraded in the future to support new technologies. This makes it a good choice for applications that require the support of new technologies, such as advanced communication systems.
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2,606 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,545.9853 | $5,545.9853 |
10+ | $5,486.3510 | $54,863.5100 |
100+ | $5,188.1798 | $518,817.9750 |
1000+ | $4,890.0085 | $2,445,004.2500 |
10000+ | $4,472.5688 | $4,472,568.7500 |
The price is for reference only, please refer to the actual quotation! |