Intel Corporation
10AX032H2F35E2SG
10AX032H2F35E2SG ECAD Model
10AX032H2F35E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX032H2F35E2SG Datasheet Download
10AX032H2F35E2SG Overview
The chip model 10AX032H2F35E2SG is one of the most advanced semiconductor products on the market today. It is designed with the most advanced technologies to meet the demands of the modern world. This chip model is used in a variety of applications, from consumer electronics to automotive systems to industrial applications. It is especially suitable for the development of advanced communication systems.
The chip model 10AX032H2F35E2SG is designed to be highly reliable and efficient, and is able to support the newest technologies and applications. It is equipped with a variety of features, such as advanced signal processing, high-speed data transmission, and low power consumption. It is also able to support the latest wireless communication technologies, such as 5G and Wi-Fi 6. This chip model is also able to support the development of new technologies such as artificial intelligence, machine learning, and edge computing.
In terms of the future applications of the chip model 10AX032H2F35E2SG, it is likely to be used in networks and intelligent scenarios. It is capable of supporting the development of fully intelligent systems, such as autonomous vehicles and smart homes. It is also likely to be used in the development of the Internet of Things (IoT), which will enable the connection and communication of all kinds of devices. In addition, the chip model 10AX032H2F35E2SG is also likely to be used in the development of advanced communication systems, such as 5G and 6G.
The chip model 10AX032H2F35E2SG is a highly reliable and efficient semiconductor product that is designed to meet the demands of the modern world. It is capable of supporting the development of a variety of technologies and applications, from consumer electronics to automotive systems to industrial applications. It is also likely to be used in the development of networks and intelligent scenarios. It is a promising product that is able to support the development of fully intelligent systems and advanced communication systems.
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4,988 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,753.5522 | $4,753.5522 |
| 10+ | $4,702.4387 | $47,024.3869 |
| 100+ | $4,446.8714 | $444,687.1368 |
| 1000+ | $4,191.3040 | $2,095,652.0240 |
| 10000+ | $3,833.5098 | $3,833,509.8000 |
| The price is for reference only, please refer to the actual quotation! | ||