Intel Corporation
10AX032H2F34I1HG
10AX032H2F34I1HG ECAD Model
10AX032H2F34I1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032H2F34I1HG Datasheet Download
10AX032H2F34I1HG Overview
The chip model 10AX032H2F34I1HG is a cutting-edge chip model that has been developed to meet the increasing demands of the modern world. It is a powerful, yet efficient, model that has been designed to handle a variety of tasks and applications. As such, it is a model that has the potential to shape the future of the industry and the development of related industries.
When it comes to the industry trends of the 10AX032H2F34I1HG chip model and the future development of related industries, it is important to consider the specific technologies that are needed. This chip model is capable of handling a wide range of tasks and applications, so it is important to understand the necessary technologies that will be required to make the most out of it. For example, if the application environment requires the support of new technologies, such as artificial intelligence or machine learning, then the 10AX032H2F34I1HG model can be upgraded to support these technologies.
In terms of the original design intention of the 10AX032H2F34I1HG chip model and the possibility of future upgrades, it is important to consider the various applications that the model can be used for. It is possible to use the model for advanced communication systems, such as 5G networks, as well as for the development and popularization of future intelligent robots. In order to use the model effectively, it is important to have the right technical talents in place. This includes engineers, programmers, and software developers who are well-versed in the various technologies that are needed to make the most out of the 10AX032H2F34I1HG chip model.
Overall, the chip model 10AX032H2F34I1HG is a powerful and efficient model that has the potential to shape the future of the industry and the development of related industries. It is important to consider the necessary technologies that are needed to make the most out of the model, as well as the various applications that it can be used for. With the right technical talents in place, the 10AX032H2F34I1HG chip model can be used to its full potential, allowing for the advancement of the industry and the development of new technologies.
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3,730 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,338.7219 | $6,338.7219 |
| 10+ | $6,270.5636 | $62,705.6360 |
| 100+ | $5,929.7721 | $592,977.2100 |
| 1000+ | $5,588.9806 | $2,794,490.3000 |
| 10000+ | $5,111.8725 | $5,111,872.5000 |
| The price is for reference only, please refer to the actual quotation! | ||