
Intel Corporation
10AX032H2F34E2SG
10AX032H2F34E2SG ECAD Model
10AX032H2F34E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 384 | |
Number of Outputs | 384 | |
Number of Logic Cells | 320000 | |
Number of CLBs | 11990 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 11990 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
10AX032H2F34E2SG Datasheet Download
10AX032H2F34E2SG Overview
The chip model 10AX032H2F34E2SG is a powerful and versatile integrated circuit that has been developed by a leading semiconductor manufacturer to meet the growing demands of the industry. This chip model is designed to provide high-performance, low-power solutions for a wide range of applications. It is also capable of supporting advanced communication systems and can be used in a variety of applications, from consumer electronics to industrial automation.
The 10AX032H2F34E2SG chip model is designed to provide a low-cost solution for a wide range of applications. It is capable of supporting multiple communication protocols, including Ethernet, Wi-Fi, and Bluetooth. The chip also supports a variety of encryption algorithms for secure data communication. The chip is also designed to be used in a variety of applications, from consumer electronics to industrial automation.
The 10AX032H2F34E2SG chip model is designed to provide a cost-effective solution for a wide range of applications. It is capable of supporting a variety of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. The chip also supports a variety of encryption algorithms for secure data communication. The chip is also designed to be used in a variety of applications, from consumer electronics to industrial automation.
The 10AX032H2F34E2SG chip model is also designed to provide a robust and reliable solution for a wide range of applications. It is capable of supporting a variety of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. The chip also supports a variety of encryption algorithms for secure data communication. The chip is also designed to be used in a variety of applications, from consumer electronics to industrial automation.
The 10AX032H2F34E2SG chip model is designed to provide a cost-effective solution for a wide range of applications. It is capable of supporting a variety of communication protocols, including Ethernet, Wi-Fi, and Bluetooth. The chip also supports a variety of encryption algorithms for secure data communication. The chip is also designed to be used in a variety of applications, from consumer electronics to industrial automation.
In terms of industry trends, the 10AX032H2F34E2SG chip model is expected to remain a popular choice for a wide range of applications, due to its low cost and reliable performance. As the demand for advanced communication systems increases, the chip model is likely to be updated to support new technologies. The chip model is also expected to remain a popular choice for a wide range of applications, due to its cost-effectiveness and reliable performance.
In terms of the original design intention of the chip model 10AX032H2F34E2SG, it is designed to provide a low-cost solution for a wide range of applications. It is capable of supporting multiple communication protocols, including Ethernet, Wi-Fi, and Bluetooth. The chip also supports a variety of encryption algorithms for secure data communication. The chip is also designed to be used in a variety of applications, from consumer electronics to industrial automation.
In terms of future upgrades, the 10AX032H2F34E2SG chip model is likely to be updated to support new technologies as the demand for advanced communication systems increases. The chip is also expected to remain a popular choice for a wide range of applications, due to its cost-effectiveness and reliable performance.
When it comes to product description and specific design requirements of the 10AX032H2F34E2SG chip model, there are a number of features that must be taken into account. These include the chip's power consumption, communication protocols, encryption algorithms, and the types of applications it can support. It is also important to consider the specific requirements of the application environment in order to ensure that the chip can provide the necessary performance.
In terms of actual case studies and precautions, it is important to note that the chip model 10AX032H2F34E2SG is designed for specific applications and should not be used in any other environment. It is also important to ensure that the chip is properly installed and configured in order to ensure optimal performance. Additionally, it is important to ensure that the chip is compatible with the application environment in order to avoid any potential problems.
In conclusion, the 10AX032H2F34E2SG chip model is a powerful and versatile integrated circuit that has been developed by a leading semiconductor manufacturer to meet the growing demands of the industry. It is designed to provide a low-cost solution for a wide range of applications, and is capable of supporting multiple communication protocols, encryption algorithms, and a variety of applications. The chip is also expected to remain a popular choice for a wide range of applications, due to its cost-effectiveness and reliable performance. It is important to consider the specific requirements of the application environment in order to ensure that the chip can provide the necessary performance, and to ensure that the chip is properly installed and configured in order to ensure optimal performance.
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4,711 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,753.5522 | $4,753.5522 |
10+ | $4,702.4387 | $47,024.3869 |
100+ | $4,446.8714 | $444,687.1368 |
1000+ | $4,191.3040 | $2,095,652.0240 |
10000+ | $3,833.5098 | $3,833,509.8000 |
The price is for reference only, please refer to the actual quotation! |