10AX032H1F34I1SG
10AX032H1F34I1SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX032H1F34I1SG


10AX032H1F34I1SG
F18-10AX032H1F34I1SG
Active
IC FPGA 384 I/O 1152FBGA
1152-FCBGA (35x35)

10AX032H1F34I1SG ECAD Model


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10AX032H1F34I1SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Transferred
Supply Voltage-Nom 900 mV
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.65 mm
Ihs Manufacturer ALTERA CORP
Package Description 35 X 35 MM, ROHS COMPLIANT, FBGA-1152
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX032H1F34I1SG Overview



Chip model 10AX032H1F34I1SG is a powerful and versatile chip that has been gaining traction in the industry due to its various features and capabilities. It is a 32-bit processor with a frequency of up to 1 GHz and an integrated ARM Cortex-A5 core. This chip is designed to provide a high-performance and low-power solution for embedded systems, and is capable of supporting a wide range of applications such as industrial, automotive, and consumer electronics.


The chip model 10AX032H1F34I1SG is designed to meet the needs of today's fast-paced and ever-evolving technology world. It is designed to be able to handle the most demanding workloads while consuming minimal power. It is also designed to be able to scale up to meet the needs of future applications. This makes it an ideal choice for use in a variety of scenarios, from simple embedded systems to advanced communication systems.


The chip model 10AX032H1F34I1SG is also designed to be able to handle the latest technologies. It is capable of supporting the latest wireless communication standards such as Wi-Fi, Bluetooth, and Zigbee. It is also capable of supporting the latest security protocols such as TLS and IPsec. These features make it ideal for use in a variety of applications, from home automation to industrial automation.


The chip model 10AX032H1F34I1SG is also designed to be able to handle the latest technologies. It is capable of supporting the latest artificial intelligence and machine learning technologies, making it ideal for use in advanced applications such as autonomous vehicles and smart cities. It is also capable of supporting the latest 5G networks, making it ideal for use in future networks and the intelligent scenarios they will enable.


The chip model 10AX032H1F34I1SG is designed to be able to handle the most demanding workloads while consuming minimal power. This makes it an ideal choice for use in a variety of applications, from simple embedded systems to advanced communication systems and the intelligent scenarios they will enable. It is also capable of supporting the latest technologies, making it ideal for use in the era of fully intelligent systems.



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