Intel Corporation
10AX032H1F34E1HG
10AX032H1F34E1HG ECAD Model
10AX032H1F34E1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032H1F34E1HG Datasheet Download
10AX032H1F34E1HG Overview
The chip model 10AX032H1F34E1HG is a powerful and versatile chip model that is suitable for a variety of applications including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which provides a powerful platform for developers to create complex and sophisticated applications.
The chip model 10AX032H1F34E1HG has several advantages that make it an ideal choice for a variety of application scenarios. It is highly energy-efficient, making it suitable for use in battery-powered devices. It also has a high level of integration, which allows for a smaller form factor and lower cost. Additionally, its flexible architecture allows for easy customization and scalability.
In the coming years, the demand for the chip model 10AX032H1F34E1HG is expected to grow significantly in the fields of digital signal processing, embedded processing, and image processing. This is due to its high performance and versatility, which make it an ideal choice for a variety of applications.
The chip model 10AX032H1F34E1HG can also be used in the development and popularization of future intelligent robots. Its powerful and versatile architecture allows for the integration of various sensors and components, which can be used to create robots with sophisticated capabilities. In order to use the model effectively, however, it is important to have a strong understanding of the HDL language and the underlying architecture of the chip model. Technical talents such as software engineers, hardware engineers, and robotics engineers are all necessary to create and deploy effective robots using the chip model 10AX032H1F34E1HG.
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1,075 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $6,469.5621 | $6,469.5621 |
| 10+ | $6,399.9969 | $63,999.9693 |
| 100+ | $6,052.1710 | $605,217.1008 |
| 1000+ | $5,704.3451 | $2,852,172.5440 |
| 10000+ | $5,217.3888 | $5,217,388.8000 |
| The price is for reference only, please refer to the actual quotation! | ||