Intel Corporation
10AX032E4F29E3LG
10AX032E4F29E3LG ECAD Model
10AX032E4F29E3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032E4F29E3LG Datasheet Download
10AX032E4F29E3LG Overview
The chip model 10AX032E4F29E3LG is a high-performance digital signal processor (DSP) that is suitable for a variety of applications, including embedded processing, image processing, and more. It is designed to be extremely powerful and offers users the ability to use HDL language, which is one of the most popular high-level programming languages used in digital signal processing. This chip model is designed to provide users with the flexibility and performance they need to achieve their goals.
The chip model 10AX032E4F29E3LG has several advantages over other DSPs, including its low power consumption, high speed, and high accuracy. It also has the ability to handle large amounts of data with ease, making it highly suitable for applications that require large amounts of data processing. Additionally, the chip model is designed to be highly reliable, making it an ideal choice for applications where reliability is a must.
The chip model 10AX032E4F29E3LG is expected to be in high demand in the future, as more and more applications require high-performance DSPs. As the demand for this chip model increases, so too will the need for upgrades and improvements to the chip model. The original design intention of the chip model 10AX032E4F29E3LG was to provide users with the flexibility and performance they need to achieve their goals. In the future, it is possible that the chip model could be upgraded to support advanced communication systems, allowing users to take advantage of the latest technology.
Overall, the chip model 10AX032E4F29E3LG is an ideal choice for a variety of applications, as it offers users the flexibility and performance they need to achieve their goals. With its low power consumption, high speed, and high accuracy, the chip model is expected to be in high demand in the future. Additionally, it is possible that the chip model could be upgraded to support advanced communication systems, allowing users to take advantage of the latest technology.
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5,532 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,443.8981 | $3,443.8981 |
| 10+ | $3,406.8669 | $34,068.6690 |
| 100+ | $3,221.7111 | $322,171.1094 |
| 1000+ | $3,036.5553 | $1,518,277.6420 |
| 10000+ | $2,777.3372 | $2,777,337.1500 |
| The price is for reference only, please refer to the actual quotation! | ||