Intel Corporation
10AX032E4F27I3SG
10AX032E4F27I3SG ECAD Model
10AX032E4F27I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX032E4F27I3SG Datasheet Download
10AX032E4F27I3SG Overview
The chip model 10AX032E4F27I3SG is a highly versatile, powerful processor that is suitable for a variety of tasks. It is capable of high-performance digital signal processing, embedded processing, and image processing, and is programmed using the HDL language. This makes it a great choice for a variety of applications, from the most basic to the most complex.
The chip model 10AX032E4F27I3SG offers a number of advantages over other chips. It is fast, efficient, and reliable, allowing for faster processing times and improved performance. It is also highly scalable, meaning it can be used in a variety of different projects. This makes it an ideal choice for those looking to create advanced applications.
The chip model 10AX032E4F27I3SG is expected to be in high demand in the future, as the demand for more powerful and efficient processors increases. This chip is ideal for those looking to create complex applications, such as artificial intelligence and machine learning. It is also highly suitable for use in networks, allowing for faster data transfer and communication.
The chip model 10AX032E4F27I3SG is also likely to be used in the future for intelligent applications. It is capable of understanding complex instructions, making it ideal for use in the era of fully intelligent systems. It is also likely to be used in networks, allowing for faster data transfer and communication.
Overall, the chip model 10AX032E4F27I3SG is a powerful and versatile processor that is suitable for a variety of tasks. It is capable of high-performance digital signal processing, embedded processing, and image processing, and is programmed using the HDL language. This makes it a great choice for a variety of applications, from the most basic to the most complex. It is expected to be in high demand in the future, as the demand for more powerful and efficient processors increases. It is also likely to be used in the future for intelligent applications, making it ideal for use in the era of fully intelligent systems.
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3,890 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $682.2480 | $682.2480 |
| 10+ | $674.9120 | $6,749.1200 |
| 100+ | $638.2320 | $63,823.2000 |
| 1000+ | $601.5520 | $300,776.0000 |
| 10000+ | $550.2000 | $550,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||