Intel Corporation
10AX032E4F27E3LG
10AX032E4F27E3LG ECAD Model
10AX032E4F27E3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX032E4F27E3LG Datasheet Download
10AX032E4F27E3LG Overview
The chip model 10AX032E4F27E3LG is a highly advanced and powerful chip designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is capable of providing the necessary power and performance for a variety of applications.
The original design intention of the chip model 10AX032E4F27E3LG was to provide a high-performance chip that could be used for a wide variety of applications. The chip is capable of providing the necessary power and performance for a variety of applications and can be easily upgraded with new features and capabilities. This makes it an ideal choice for high-end applications such as advanced communication systems.
The chip model 10AX032E4F27E3LG can also be used for the development and popularization of future intelligent robots. This chip model is capable of providing the necessary computing power and performance for a variety of applications, including robotics. In order to use the model effectively, it requires a certain level of technical expertise, such as knowledge of HDL language and the ability to program and debug hardware and software.
In conclusion, the chip model 10AX032E4F27E3LG is a powerful and versatile chip designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The chip is capable of providing the necessary power and performance for a variety of applications and can be easily upgraded with new features and capabilities. It can also be used for the development and popularization of future intelligent robots, however, it requires a certain level of technical expertise in order to use the model effectively.
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3,207 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,102.7581 | $3,102.7581 |
| 10+ | $3,069.3951 | $30,693.9508 |
| 100+ | $2,902.5801 | $290,258.0130 |
| 1000+ | $2,735.7652 | $1,367,882.5900 |
| 10000+ | $2,502.2243 | $2,502,224.2500 |
| The price is for reference only, please refer to the actual quotation! | ||