
Intel Corporation
10AX032E3F29I2SG
10AX032E3F29I2SG ECAD Model
10AX032E3F29I2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 320000 | |
Number of CLBs | 11990 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 11990 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA784,28X28,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 |
10AX032E3F29I2SG Datasheet Download
10AX032E3F29I2SG Overview
The chip model 10AX032E3F29I2SG is a device that is becoming increasingly popular in the industry, as it offers a range of advantages that make it a great choice for many applications. It is a cost-effective, low-power, and high-performance processor that is designed to meet the needs of a wide range of applications. It is designed to provide a high level of performance, while also consuming less power than other processors. This makes it an ideal choice for a range of applications, from industrial automation to consumer electronics.
The chip model 10AX032E3F29I2SG is also designed to be highly compatible with a range of networks and platforms, allowing it to be used in a wide range of scenarios. It is capable of supporting a range of technologies, such as Wi-Fi, Bluetooth, and Zigbee, making it a great choice for many applications. It is also designed to be highly reliable, ensuring that it can provide a consistent level of performance.
In terms of future industry trends, the chip model 10AX032E3F29I2SG is expected to be in high demand in the coming years. As more and more applications require low-power, high-performance processors, the demand for this model is likely to remain strong. The chip model is also likely to be used in more intelligent scenarios, as it is capable of supporting a range of technologies that can be used to create intelligent systems. It is also likely to be used in the era of fully intelligent systems, as it is capable of providing the performance and reliability required for such applications.
Overall, the chip model 10AX032E3F29I2SG is a great choice for a range of applications, from industrial automation to consumer electronics. It is designed to provide a high level of performance, while also consuming less power than other processors. It is also capable of supporting a range of technologies, making it a great choice for many applications. It is also likely to be used in more intelligent scenarios, as it is capable of supporting a range of technologies that can be used to create intelligent systems. As such, it is expected to be in high demand in the coming years, as more and more applications require low-power, high-performance processors.
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1,950 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,243.1396 | $4,243.1396 |
10+ | $4,197.5144 | $41,975.1444 |
100+ | $3,969.3887 | $396,938.8659 |
1000+ | $3,741.2629 | $1,870,631.4370 |
10000+ | $3,421.8868 | $3,421,886.7750 |
The price is for reference only, please refer to the actual quotation! |