Intel Corporation
10AX032E3F29E2LG
10AX032E3F29E2LG ECAD Model
10AX032E3F29E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032E3F29E2LG Datasheet Download
10AX032E3F29E2LG Overview
The chip model 10AX032E3F29E2LG is a multi-function device developed for high-performance digital signal processing, embedded processing, and image processing. It is designed with an HDL language and is capable of performing complex operations in a wide range of applications. With its high-performance processing capabilities, it is capable of supporting various advanced communication systems and is suitable for a wide range of applications.
The original design intention of the chip model 10AX032E3F29E2LG was to provide a high-performance, cost-effective solution for digital signal processing, embedded processing, and image processing. It is designed to be a powerful and flexible solution, which can be easily upgraded to meet the changing requirements of the user. It is also designed to be compatible with a wide range of advanced communication systems, making it a great choice for a variety of applications.
The product description of the chip model 10AX032E3F29E2LG includes its core features, such as its ability to process complex operations quickly and efficiently. It also includes its compatibility with a wide range of communication systems and its ability to upgrade with ease. It also includes its ability to support multiple applications, such as digital signal processing, embedded processing, and image processing.
The design requirements of the chip model 10AX032E3F29E2LG include the use of HDL language, the ability to process complex operations quickly and efficiently, and the ability to support multiple applications. Additionally, it should be able to be easily upgraded to meet the changing requirements of the user.
Actual case studies and precautions for the chip model 10AX032E3F29E2LG include the use of HDL language, the ability to process complex operations quickly and efficiently, and the ability to support multiple applications. Additionally, users should be aware of the chip’s power requirements and the potential for it to overheat when running complex operations. Additionally, users should be aware of the potential for compatibility issues with certain communication systems.
Overall, the chip model 10AX032E3F29E2LG is a powerful and flexible solution for high-performance digital signal processing, embedded processing, and image processing. With its high-performance processing capabilities, it is capable of supporting various advanced communication systems and is suitable for a wide range of applications. Users should be aware of its design requirements, actual case studies, and potential compatibility issues when using the chip.
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5,581 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,545.2920 | $4,545.2920 |
| 10+ | $4,496.4178 | $44,964.1784 |
| 100+ | $4,252.0473 | $425,204.7309 |
| 1000+ | $4,007.6768 | $2,003,838.3870 |
| 10000+ | $3,665.5580 | $3,665,558.0250 |
| The price is for reference only, please refer to the actual quotation! | ||