
Intel Corporation
10AX032E3F27E2SG
10AX032E3F27E2SG ECAD Model
10AX032E3F27E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 320000 | |
Number of CLBs | 11990 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 11990 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA672,26X26,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 |
10AX032E3F27E2SG Datasheet Download
10AX032E3F27E2SG Overview
The chip model 10AX032E3F27E2SG is a powerful and versatile piece of technology that has the potential to revolutionize the way we interact with computers and networks. Developed by Intel, this chip model is designed to be used in a variety of applications, from desktop computers to servers and mobile devices. It is an advanced chip model that provides a high level of performance and reliability.
The 10AX032E3F27E2SG chip model is capable of supporting a wide range of technologies, from the latest in artificial intelligence algorithms to the most advanced networking protocols. The chip model is designed to be used in a variety of scenarios, including the Internet of Things (IoT) and autonomous vehicles. It can also be used in applications that require real-time data processing, such as medical imaging, robotics, and autonomous systems.
The 10AX032E3F27E2SG chip model is designed to be used in a variety of network architectures, including 5G, Wi-Fi, Bluetooth, and Zigbee. It is capable of supporting a variety of communications protocols, including TCP/IP, UDP, and HTTP. It also supports a variety of security protocols, such as AES, SHA-256, and RSA.
In terms of its design, the 10AX032E3F27E2SG chip model is designed to be used in a variety of environments and applications. It is designed to be used in high-performance systems that require a high level of reliability and performance. It is also designed to be used in low-power applications, such as battery-powered devices. The chip model is designed to be used in a variety of intelligent scenarios, such as autonomous vehicles, robotics, and artificial intelligence applications.
The 10AX032E3F27E2SG chip model is designed to be used in a variety of scenarios, from desktop computers to mobile devices. It is designed to be used in a variety of applications, from medical imaging to robotics and autonomous systems. It is also designed to be used in a variety of network architectures, including 5G, Wi-Fi, Bluetooth, and Zigbee.
When it comes to the actual use of the 10AX032E3F27E2SG chip model, there are a few things to consider. Firstly, the chip model must be configured correctly to ensure that it is able to perform optimally. Secondly, the chip model must be tested thoroughly to ensure that it is able to meet the requirements of the application. Finally, the chip model must be maintained regularly to ensure that it remains in optimal condition.
The industry trends of the 10AX032E3F27E2SG chip model are constantly changing, as new technologies and applications are introduced. It is important to keep up with these trends to ensure that the chip model is able to be used in the most efficient manner possible. It is also important to consider the future applications of the chip model and whether it is possible to be used in the era of fully intelligent systems.
In conclusion, the 10AX032E3F27E2SG chip model is a powerful and versatile piece of technology that has the potential to revolutionize the way we interact with computers and networks. It is designed to be used in a variety of applications, from desktop computers to servers and mobile devices, and it is capable of supporting a wide range of technologies. It is important to consider the industry trends of the chip model and the future applications of the chip model, as well as the actual design requirements and case studies.
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1,528 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $749.9545 | $749.9545 |
10+ | $741.8905 | $7,418.9048 |
100+ | $701.5703 | $70,157.0349 |
1000+ | $661.2502 | $330,625.1070 |
10000+ | $604.8020 | $604,802.0250 |
The price is for reference only, please refer to the actual quotation! |