Intel Corporation
10AX032E2F29I2SG
10AX032E2F29I2SG ECAD Model
10AX032E2F29I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032E2F29I2SG Datasheet Download
10AX032E2F29I2SG Overview
The chip model 10AX032E2F29I2SG is a cutting-edge microchip designed by Intel, and it is one of the most advanced microchips currently available in the market. It is designed to be used in a wide variety of applications, including complex network systems, intelligent systems, and advanced communication systems.
This chip model offers a range of advantages that make it suitable for use in these applications. Firstly, it is extremely powerful and efficient. It is capable of handling large amounts of data and processing power, making it suitable for use in complex network systems and intelligent systems. Furthermore, it has a low power consumption rate and a high level of reliability, making it suitable for use in advanced communication systems.
The chip model 10AX032E2F29I2SG also has a number of features that make it suitable for use in the future. It is designed to be easily upgradable, meaning that it can be used in the future with the latest technologies. Furthermore, it is capable of being used in fully intelligent systems, making it suitable for use in the era of fully intelligent systems.
The chip model 10AX032E2F29I2SG is expected to see increasing demand in the future, as more and more industries are looking for powerful and reliable microchips for their applications. It is already being used in a wide range of industries, including telecommunications, automotive, and healthcare. As the need for more powerful and reliable microchips increases, the demand for the 10AX032E2F29I2SG is expected to grow significantly.
In addition to its current applications, the chip model 10AX032E2F29I2SG is also expected to be used in a number of new applications in the future. It is likely to be used in networks, as it is capable of handling large amounts of data and processing power. Furthermore, it could be used in intelligent scenarios, such as autonomous vehicles and intelligent home systems. Finally, it is likely to be used in the era of fully intelligent systems, as it is capable of being used in complex network systems and intelligent systems.
In conclusion, the chip model 10AX032E2F29I2SG is an advanced microchip that is capable of handling large amounts of data and processing power. It is suitable for use in a wide range of applications, including complex network systems, intelligent systems, and advanced communication systems. It is also designed to be easily upgradable, making it suitable for use in the future with the latest technologies. Furthermore, it is expected to see increasing demand in the future, as more and more industries are looking for powerful and reliable microchips for their applications. Finally, it is likely to be used in a number of new applications in the future, such as networks, intelligent scenarios, and the era of fully intelligent systems.
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5,259 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,233.5031 | $4,233.5031 |
| 10+ | $4,187.9816 | $41,879.8159 |
| 100+ | $3,960.3739 | $396,037.3893 |
| 1000+ | $3,732.7662 | $1,866,383.0990 |
| 10000+ | $3,414.1154 | $3,414,115.4250 |
| The price is for reference only, please refer to the actual quotation! | ||