
Intel Corporation
10AX032E2F29E2LG
10AX032E2F29E2LG ECAD Model
10AX032E2F29E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 320000 | |
Number of CLBs | 11990 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 11990 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA784,28X28,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 |
10AX032E2F29E2LG Datasheet Download
10AX032E2F29E2LG Overview
The chip model 10AX032E2F29E2LG is a product of the latest technology designed to meet the needs of advanced communication systems. This chip model is based on a 32-bit architecture and is equipped with a wide range of features to provide high-speed and reliable performance. The product is designed to be compatible with various types of communication protocols, including Ethernet, Wi-Fi, Bluetooth, and others.
The original design intention of the chip model 10AX032E2F29E2LG was to provide a high-performance, low-power solution for advanced communication systems. The chip model is capable of handling a wide range of data rates, and its onboard memory can store up to 32-bits of data. In addition, the chip model also supports a wide range of communication protocols, making it suitable for a variety of applications.
The possibility of future upgrades to the chip model 10AX032E2F29E2LG is also quite high. The chip model is designed to be easily upgradable, allowing users to add new features and capabilities. The chip model also supports a wide range of communication protocols, making it suitable for a variety of applications.
The product description and specific design requirements of the chip model 10AX032E2F29E2LG are detailed in the product manual. The product manual contains all the necessary information about the chip model, including its features, specifications, and design requirements. In addition, the product manual also provides detailed instructions on how to use the chip model effectively.
Case studies and precautions should also be taken into consideration when using the chip model 10AX032E2F29E2LG. The chip model is designed to be highly reliable, but it should be used with caution. It is important to follow the instructions provided in the product manual in order to ensure the chip model is used correctly.
The chip model 10AX032E2F29E2LG can also be applied to the development and popularization of future intelligent robots. The chip model is capable of handling a wide range of data rates, and its onboard memory can store up to 32-bits of data. This makes it suitable for a variety of applications, including robotics.
In order to use the chip model 10AX032E2F29E2LG effectively, certain technical talents are needed. Knowledge of programming languages such as C++ and Java is essential for developing applications for the chip model. In addition, knowledge of communication protocols and hardware design is also necessary for using the chip model effectively.
In conclusion, the chip model 10AX032E2F29E2LG is a highly reliable and powerful chip model designed to meet the needs of advanced communication systems. The product is designed to be compatible with various types of communication protocols, and its onboard memory can store up to 32-bits of data. The chip model is also capable of being upgraded, allowing users to add new features and capabilities. Finally, the chip model is suitable for a variety of applications, including robotics, and certain technical talents are needed to use the chip model effectively.
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3,690 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,958.5924 | $4,958.5924 |
10+ | $4,905.2742 | $49,052.7422 |
100+ | $4,638.6832 | $463,868.3226 |
1000+ | $4,372.0922 | $2,186,046.1180 |
10000+ | $3,998.8649 | $3,998,864.8500 |
The price is for reference only, please refer to the actual quotation! |