Intel Corporation
10AX032E2F29E1HG
10AX032E2F29E1HG ECAD Model
10AX032E2F29E1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032E2F29E1HG Datasheet Download
10AX032E2F29E1HG Overview
The chip model 10AX032E2F29E1HG is a new development in the semiconductor industry, providing an efficient way to process data and control systems. This model is designed to be energy efficient, cost effective and capable of performing complex tasks. It is expected to be widely used in the industry in the near future.
The 10AX032E2F29E1HG model has many advantages over its predecessors. It is designed to consume less power, which makes it more energy efficient and cost effective. Furthermore, its high processing speed allows it to handle complex tasks more quickly and accurately. These features make this chip model ideal for a wide range of applications, including industrial automation, robotics, and artificial intelligence.
In terms of industry trends, the 10AX032E2F29E1HG model is expected to be used in more applications and industries in the future. This chip model can be used to improve the efficiency and accuracy of industrial automation systems. It can also be used in the development and popularization of intelligent robots, allowing them to perform complex tasks more quickly and accurately.
In order to use the 10AX032E2F29E1HG model effectively, the application environment must require the support of new technologies. This includes the development of new algorithms and software that can take advantage of the chip model's capabilities. Additionally, it may require the use of specialized hardware and software to effectively utilize the chip model. Technical expertise in the areas of computer engineering, robotics, and artificial intelligence will be necessary to effectively use the chip model.
Overall, the 10AX032E2F29E1HG chip model is a versatile and efficient tool for data processing and system control. It is expected to be widely used in many industries in the near future, and its capabilities can be utilized to improve industrial automation and the development of intelligent robots. In order to use the chip model effectively, the application environment must require the support of new technologies, and technical expertise in the areas of computer engineering, robotics, and artificial intelligence will be necessary.
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1,747 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,629.7568 | $4,629.7568 |
| 10+ | $4,579.9745 | $45,799.7445 |
| 100+ | $4,331.0628 | $433,106.2797 |
| 1000+ | $4,082.1511 | $2,041,075.5710 |
| 10000+ | $3,733.6748 | $3,733,674.8250 |
| The price is for reference only, please refer to the actual quotation! | ||