Intel Corporation
10AX032E2F27I2SG
10AX032E2F27I2SG ECAD Model
10AX032E2F27I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX032E2F27I2SG Datasheet Download
10AX032E2F27I2SG Overview
The chip model 10AX032E2F27I2SG is a powerful and versatile integrated circuit designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. It is also capable of being programmed using the HDL language, making it a great choice for a variety of projects.
The original design intention of the chip model 10AX032E2F27I2SG was to provide a powerful and versatile solution for a variety of tasks. It is capable of being upgraded and modified to suit the needs of the user, making it a great choice for projects that require a lot of flexibility. It is also capable of being used in advanced communication systems, making it a great choice for those who need to stay connected.
The chip model 10AX032E2F27I2SG is also capable of being applied to the development and popularization of future intelligent robots. It is capable of performing complex tasks and responding to various stimuli, making it a great choice for those who need a powerful and reliable solution for their robotics projects. It requires a certain level of technical skill to use the model effectively, but with the right training and dedication, it can be used to create amazing and powerful robots.
In conclusion, the chip model 10AX032E2F27I2SG is a powerful and versatile integrated circuit designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related tasks. It is also capable of being programmed using the HDL language, making it a great choice for a variety of projects. It is also capable of being used in advanced communication systems and applied to the development and popularization of future intelligent robots. It requires a certain level of technical skill to use the model effectively, but with the right training and dedication, it can be used to create amazing and powerful robots.
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5,183 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,171.9581 | $4,171.9581 |
| 10+ | $4,127.0983 | $41,270.9829 |
| 100+ | $3,902.7995 | $390,279.9468 |
| 1000+ | $3,678.5006 | $1,839,250.3240 |
| 10000+ | $3,364.4823 | $3,364,482.3000 |
| The price is for reference only, please refer to the actual quotation! | ||