10AX032E2F27I2LG
10AX032E2F27I2LG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX032E2F27I2LG


10AX032E2F27I2LG
F18-10AX032E2F27I2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA672,26X26,40
BGA, BGA672,26X26,40

10AX032E2F27I2LG ECAD Model


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10AX032E2F27I2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 320000
Number of CLBs 11990
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 11990 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AX032E2F27I2LG Datasheet Download


10AX032E2F27I2LG Overview



The chip model 10AX032E2F27I2LG is a cutting-edge semiconductor product developed by a leading chip manufacturer. It is designed for use in a variety of applications, including communication systems, networks, and intelligent scenarios. This chip model is equipped with advanced technologies that allow it to be used in the era of fully intelligent systems.


As the industry trends of the chip model 10AX032E2F27I2LG continue to evolve, the potential applications of this chip are expanding. It can be used in a variety of communication systems, from basic networks to advanced communication systems. The chip model 10AX032E2F27I2LG is also capable of supporting intelligent scenarios, such as artificial intelligence and machine learning. This chip model is also capable of supporting the latest technologies, such as 5G networks and the Internet of Things.


In terms of the original design intention of the chip model 10AX032E2F27I2LG, it was designed to provide a reliable and efficient platform for a variety of applications. The chip model 10AX032E2F27I2LG is also designed to be upgradable, allowing it to keep up with the latest trends in the industry. This chip model is also capable of supporting the latest technologies, such as 5G networks and the Internet of Things, allowing it to be used in the era of fully intelligent systems.


In terms of the future development of the chip model 10AX032E2F27I2LG, it is expected to continue to be used in a variety of applications. The chip model 10AX032E2F27I2LG is expected to continue to be used in communication systems, networks, and intelligent scenarios. It is also expected to continue to be used in the era of fully intelligent systems, as it is capable of supporting the latest technologies.


Overall, the chip model 10AX032E2F27I2LG is a cutting-edge semiconductor product that is designed for use in a variety of applications. It is equipped with advanced technologies that allow it to be used in the era of fully intelligent systems. The chip model 10AX032E2F27I2LG is also designed to be upgradable and capable of supporting the latest technologies, making it a valuable asset for any application.



3,006 In Stock


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Unit Price: $5,604.7729
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,212.4388 $5,212.4388
10+ $5,156.3911 $51,563.9107
100+ $4,876.1524 $487,615.2423
1000+ $4,595.9138 $2,297,956.8890
10000+ $4,203.5797 $4,203,579.6750
The price is for reference only, please refer to the actual quotation!

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