
Intel Corporation
10AX032E2F27I2LG
10AX032E2F27I2LG ECAD Model
10AX032E2F27I2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 320000 | |
Number of CLBs | 11990 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 11990 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA672,26X26,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
10AX032E2F27I2LG Datasheet Download
10AX032E2F27I2LG Overview
The chip model 10AX032E2F27I2LG is a cutting-edge semiconductor product developed by a leading chip manufacturer. It is designed for use in a variety of applications, including communication systems, networks, and intelligent scenarios. This chip model is equipped with advanced technologies that allow it to be used in the era of fully intelligent systems.
As the industry trends of the chip model 10AX032E2F27I2LG continue to evolve, the potential applications of this chip are expanding. It can be used in a variety of communication systems, from basic networks to advanced communication systems. The chip model 10AX032E2F27I2LG is also capable of supporting intelligent scenarios, such as artificial intelligence and machine learning. This chip model is also capable of supporting the latest technologies, such as 5G networks and the Internet of Things.
In terms of the original design intention of the chip model 10AX032E2F27I2LG, it was designed to provide a reliable and efficient platform for a variety of applications. The chip model 10AX032E2F27I2LG is also designed to be upgradable, allowing it to keep up with the latest trends in the industry. This chip model is also capable of supporting the latest technologies, such as 5G networks and the Internet of Things, allowing it to be used in the era of fully intelligent systems.
In terms of the future development of the chip model 10AX032E2F27I2LG, it is expected to continue to be used in a variety of applications. The chip model 10AX032E2F27I2LG is expected to continue to be used in communication systems, networks, and intelligent scenarios. It is also expected to continue to be used in the era of fully intelligent systems, as it is capable of supporting the latest technologies.
Overall, the chip model 10AX032E2F27I2LG is a cutting-edge semiconductor product that is designed for use in a variety of applications. It is equipped with advanced technologies that allow it to be used in the era of fully intelligent systems. The chip model 10AX032E2F27I2LG is also designed to be upgradable and capable of supporting the latest technologies, making it a valuable asset for any application.
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3,006 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,212.4388 | $5,212.4388 |
10+ | $5,156.3911 | $51,563.9107 |
100+ | $4,876.1524 | $487,615.2423 |
1000+ | $4,595.9138 | $2,297,956.8890 |
10000+ | $4,203.5797 | $4,203,579.6750 |
The price is for reference only, please refer to the actual quotation! |