Intel Corporation
10AX032E2F27I1HG
10AX032E2F27I1HG ECAD Model
10AX032E2F27I1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032E2F27I1HG Datasheet Download
10AX032E2F27I1HG Overview
The chip model 10AX032E2F27I1HG is an advanced integrated circuit (IC) that is widely used in a variety of industries, including consumer electronics, automotive, medical, and aerospace. It has a wide range of applications, from low-power applications to high-performance applications. As the complexity of ICs increases, the demand for the chip model 10AX032E2F27I1HG has grown significantly.
The 10AX032E2F27I1HG is a highly integrated, low-power and low-cost IC designed for high-speed data transmission. It offers a wide range of features, including a low-voltage differential signaling (LVDS) interface, high-speed data transfer, and a wide range of power management options. The chip model is also designed to be compatible with a variety of communication protocols, including USB and Ethernet.
The 10AX032E2F27I1HG is an ideal choice for applications requiring high-speed, low-power data transmission. It is also suitable for a wide range of applications, including automotive, medical, and aerospace. In addition, the chip model is also suitable for use in networks, such as 5G and Wi-Fi, and for intelligent scenarios, such as artificial intelligence (AI) and machine learning (ML).
As the demand for the chip model 10AX032E2F27I1HG increases, the industry trends of the chip model are expected to remain strong. This is because the chip model is designed to meet the demands of a wide range of applications and is capable of providing a reliable, low-power, and high-speed data transmission.
In addition, the chip model 10AX032E2F27I1HG is expected to be used in the future in the era of fully intelligent systems. This is because the chip model is capable of providing high-speed data transmission, low-power consumption, and a wide range of features that are suitable for AI and ML applications.
Overall, the chip model 10AX032E2F27I1HG is an ideal choice for applications requiring high-speed, low-power data transmission. It is also suitable for a wide range of applications, including automotive, medical, and aerospace. In addition, the chip model is expected to be used in the future in the era of fully intelligent systems, as it is capable of providing high-speed data transmission, low-power consumption, and a wide range of features that are suitable for AI and ML applications.
You May Also Be Interested In
4,692 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,447.8701 | $5,447.8701 |
| 10+ | $5,389.2908 | $53,892.9082 |
| 100+ | $5,096.3946 | $509,639.4576 |
| 1000+ | $4,803.4983 | $2,401,749.1680 |
| 10000+ | $4,393.4436 | $4,393,443.6000 |
| The price is for reference only, please refer to the actual quotation! | ||