
Intel Corporation
10AX032E2F27E2SG
10AX032E2F27E2SG ECAD Model
10AX032E2F27E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 320000 | |
Number of CLBs | 11990 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 11990 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA672,26X26,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
10AX032E2F27E2SG Datasheet Download
10AX032E2F27E2SG Overview
The chip model 10AX032E2F27E2SG is a high-performance, low-power FPGA device that is ideal for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed to be highly flexible, allowing for future upgrades and modifications as needed.
The 10AX032E2F27E2SG chip model is designed with a variety of features that make it suitable for advanced communication systems. It has a maximum operating frequency of up to 550 MHz, and its power consumption is as low as 0.9 W. The device also has a wide range of I/O, including a high-speed LVDS interface and a high-speed serial interface. Additionally, it has a large number of logic elements, enabling it to process complex algorithms in a short amount of time.
The 10AX032E2F27E2SG chip model is also designed with a number of features that make it suitable for a variety of applications. It has a flexible architecture that allows for the integration of different types of peripherals, such as memories, analog-to-digital converters, and digital-to-analog converters. Additionally, it has a wide range of features that make it suitable for high-speed data communication, such as a high-speed serial interface and a high-speed LVDS interface. It also has a wide range of features that make it suitable for image processing, such as a multi-channel ADC and a multi-channel DAC.
When designing a system that uses the 10AX032E2F27E2SG chip model, it is important to consider a number of factors. It is important to ensure that the system is designed to meet the specific requirements of the application. Additionally, it is important to ensure that the system is designed to take advantage of the features of the chip model, such as the high-speed serial interface and the high-speed LVDS interface. Additionally, it is important to ensure that the system is designed to be as power efficient as possible.
In addition to these design considerations, it is also important to consider a number of case studies when designing a system that uses the 10AX032E2F27E2SG chip model. These case studies can provide valuable insight into how the chip model can be used in real-world applications. Additionally, these case studies can provide a better understanding of the device’s capabilities and limitations.
When designing a system that uses the 10AX032E2F27E2SG chip model, it is important to consider a number of precautions. It is important to ensure that the system is designed to meet the specific requirements of the application. Additionally, it is important to ensure that the system is designed to take advantage of the features of the chip model, such as the high-speed serial interface and the high-speed LVDS interface. Additionally, it is important to ensure that the system is designed to be as power efficient as possible.
The 10AX032E2F27E2SG chip model is a powerful and versatile device that can be used for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. Additionally, it is designed with a flexible architecture that allows for the integration of different types of peripherals, such as memories, analog-to-digital converters, and digital-to-analog converters. Additionally, it has a wide range of features that make it suitable for high-speed data communication, such as a high-speed serial interface and a high-speed LVDS interface. Additionally, it has a wide range of features that make it suitable for image processing, such as a multi-channel ADC and a multi-channel DAC. When designing a system that uses the 10AX032E2F27E2SG chip model, it is important to consider a number of factors, such as the specific requirements of the application, the features of the chip model, and the power efficiency of the system. Additionally, it is important to consider a number of case studies and precautions.
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4,810 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,573.8471 | $3,573.8471 |
10+ | $3,535.4186 | $35,354.1860 |
100+ | $3,343.2763 | $334,327.6281 |
1000+ | $3,151.1340 | $1,575,566.9830 |
10000+ | $2,882.1347 | $2,882,134.7250 |
The price is for reference only, please refer to the actual quotation! |