10AX032E2F27E2SG
10AX032E2F27E2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX032E2F27E2SG


10AX032E2F27E2SG
F18-10AX032E2F27E2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA672,26X26,40
BGA, BGA672,26X26,40

10AX032E2F27E2SG ECAD Model


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10AX032E2F27E2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 320000
Number of CLBs 11990
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 11990 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AX032E2F27E2SG Datasheet Download


10AX032E2F27E2SG Overview



The chip model 10AX032E2F27E2SG is a high-performance, low-power FPGA device that is ideal for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is designed to be highly flexible, allowing for future upgrades and modifications as needed.


The 10AX032E2F27E2SG chip model is designed with a variety of features that make it suitable for advanced communication systems. It has a maximum operating frequency of up to 550 MHz, and its power consumption is as low as 0.9 W. The device also has a wide range of I/O, including a high-speed LVDS interface and a high-speed serial interface. Additionally, it has a large number of logic elements, enabling it to process complex algorithms in a short amount of time.


The 10AX032E2F27E2SG chip model is also designed with a number of features that make it suitable for a variety of applications. It has a flexible architecture that allows for the integration of different types of peripherals, such as memories, analog-to-digital converters, and digital-to-analog converters. Additionally, it has a wide range of features that make it suitable for high-speed data communication, such as a high-speed serial interface and a high-speed LVDS interface. It also has a wide range of features that make it suitable for image processing, such as a multi-channel ADC and a multi-channel DAC.


When designing a system that uses the 10AX032E2F27E2SG chip model, it is important to consider a number of factors. It is important to ensure that the system is designed to meet the specific requirements of the application. Additionally, it is important to ensure that the system is designed to take advantage of the features of the chip model, such as the high-speed serial interface and the high-speed LVDS interface. Additionally, it is important to ensure that the system is designed to be as power efficient as possible.


In addition to these design considerations, it is also important to consider a number of case studies when designing a system that uses the 10AX032E2F27E2SG chip model. These case studies can provide valuable insight into how the chip model can be used in real-world applications. Additionally, these case studies can provide a better understanding of the device’s capabilities and limitations.


When designing a system that uses the 10AX032E2F27E2SG chip model, it is important to consider a number of precautions. It is important to ensure that the system is designed to meet the specific requirements of the application. Additionally, it is important to ensure that the system is designed to take advantage of the features of the chip model, such as the high-speed serial interface and the high-speed LVDS interface. Additionally, it is important to ensure that the system is designed to be as power efficient as possible.


The 10AX032E2F27E2SG chip model is a powerful and versatile device that can be used for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. Additionally, it is designed with a flexible architecture that allows for the integration of different types of peripherals, such as memories, analog-to-digital converters, and digital-to-analog converters. Additionally, it has a wide range of features that make it suitable for high-speed data communication, such as a high-speed serial interface and a high-speed LVDS interface. Additionally, it has a wide range of features that make it suitable for image processing, such as a multi-channel ADC and a multi-channel DAC. When designing a system that uses the 10AX032E2F27E2SG chip model, it is important to consider a number of factors, such as the specific requirements of the application, the features of the chip model, and the power efficiency of the system. Additionally, it is important to consider a number of case studies and precautions.



4,810 In Stock


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Unit Price: $3,842.8463
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,573.8471 $3,573.8471
10+ $3,535.4186 $35,354.1860
100+ $3,343.2763 $334,327.6281
1000+ $3,151.1340 $1,575,566.9830
10000+ $2,882.1347 $2,882,134.7250
The price is for reference only, please refer to the actual quotation!

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