Intel Corporation
10AX032E2F27E1SG
10AX032E2F27E1SG ECAD Model
10AX032E2F27E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 320000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX032E2F27E1SG Overview
The chip model 10AX032E2F27E1SG is a highly advanced integrated circuit developed by a leading semiconductor manufacturer. It is designed to provide a high level of performance and reliability in a wide range of applications, including communication systems, networks, and intelligent systems.
The chip model 10AX032E2F27E1SG is designed to meet the ever-growing demands of the modern digital world. It is capable of handling a wide range of communication protocols, data formats, and other applications. This makes it a perfect choice for a variety of applications, from traditional communication systems to advanced networks and intelligent systems.
The chip model 10AX032E2F27E1SG is also designed to meet the needs of the future. It is equipped with the latest technologies and features that can be used to support new applications and technologies. This makes it a great choice for those who are looking for a chip that can keep up with the latest trends in the industry.
The chip model 10AX032E2F27E1SG is also designed to be highly reliable and efficient. It is designed to be able to handle a wide range of data formats and communication protocols. This makes it a great choice for those who are looking for a chip that can handle a variety of applications, from traditional communication systems to advanced networks and intelligent systems.
The chip model 10AX032E2F27E1SG is also designed to be highly scalable and flexible. It is designed to be able to be used in a variety of scenarios, from simple communication systems to complex networks and intelligent systems. This makes it a great choice for those who are looking for a chip that can be used in the era of fully intelligent systems.
Overall, the chip model 10AX032E2F27E1SG is a highly advanced integrated circuit that is designed to meet the needs of the modern digital world. It is capable of handling a wide range of communication protocols, data formats, and other applications. It is also designed to be highly reliable, efficient, and scalable. This makes it a great choice for those who are looking for a chip that can keep up with the latest trends in the industry and be used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||