Intel Corporation
10AX032E2F27E1HG
10AX032E2F27E1HG ECAD Model
10AX032E2F27E1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 320000 | |
| Number of CLBs | 11990 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 11990 CLBS | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX032E2F27E1HG Datasheet Download
10AX032E2F27E1HG Overview
The chip model 10AX032E2F27E1HG is a highly advanced processor that is ideal for digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. With its cutting-edge capabilities, the 10AX032E2F27E1HG is a powerful solution for a wide range of tasks.
The 10AX032E2F27E1HG is designed to be highly efficient and reliable, making it an ideal choice for many applications. It is also capable of handling large amounts of data quickly and accurately. Additionally, its advanced features allow it to be used in a variety of different applications, making it a versatile and cost-effective solution.
The 10AX032E2F27E1HG is designed to be highly scalable, allowing it to be used in a wide range of tasks. This scalability makes it an attractive option for businesses that need to process large amounts of data quickly and accurately. Additionally, its advanced features make it well-suited for applications that require the use of new technologies.
The 10AX032E2F27E1HG offers a number of advantages, including its high performance, scalability, and reliability. Additionally, its advanced features make it an attractive option for many businesses. As such, it is expected that the demand for the 10AX032E2F27E1HG will continue to grow in the future.
In conclusion, the chip model 10AX032E2F27E1HG is an ideal choice for digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. Its advanced features, scalability, and reliability make it an attractive option for businesses that need to process large amounts of data quickly and accurately. Additionally, its advanced features make it well-suited for applications that require the use of new technologies. As such, the 10AX032E2F27E1HG is expected to continue to be in high demand in the future.
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4,983 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,172.2454 | $4,172.2454 |
| 10+ | $4,127.3826 | $41,273.8257 |
| 100+ | $3,903.0683 | $390,306.8298 |
| 1000+ | $3,678.7540 | $1,839,377.0140 |
| 10000+ | $3,364.7141 | $3,364,714.0500 |
| The price is for reference only, please refer to the actual quotation! | ||