Intel Corporation
10AX032E1F27E1SG
10AX032E1F27E1SG ECAD Model
10AX032E1F27E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 320000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX032E1F27E1SG Overview
The chip model 10AX032E1F27E1SG is an advanced integrated circuit that is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL language, which is a hardware description language that allows users to program and design the chip.
As the chip model 10AX032E1F27E1SG is designed for high-performance digital signal processing, it can be used in networks and other intelligent scenarios. It is possible to use the chip model 10AX032E1F27E1SG in the era of fully intelligent systems, as it is designed to be able to handle complex tasks.
The chip model 10AX032E1F27E1SG can also be used for the development and popularization of future intelligent robots. It is designed to be able to handle complex tasks and is reliable in performance. To use the chip model 10AX032E1F27E1SG effectively, technical talents are needed, such as knowledge in HDL language and experience in programming, design, and troubleshooting.
Overall, the chip model 10AX032E1F27E1SG is a powerful integrated circuit that can be used for high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL language and can be used in networks and other intelligent scenarios. It is also possible to use the chip model 10AX032E1F27E1SG for the development and popularization of future intelligent robots. To use the chip model 10AX032E1F27E1SG effectively, technical talents are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||