Intel Corporation
10AX027H4F35I3SG
10AX027H4F35I3SG ECAD Model
10AX027H4F35I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027H4F35I3SG Datasheet Download
10AX027H4F35I3SG Overview
The chip model 10AX027H4F35I3SG is a high-performance digital signal processor with a range of applications in embedded processing, image processing, and other areas. It is designed to be used in conjunction with HDL language, which is a high-level language used to program, simulate, and test digital circuits. This chip model is suitable for a wide variety of applications, such as digital signal processing, embedded processing, image processing, and more.
The industry trends of the chip model 10AX027H4F35I3SG and the future development of related industries depend on the technologies required to support the application environment. As technology advances and new technologies become available, the chip model 10AX027H4F35I3SG can be used in more advanced applications. For example, it could be used in networks and applied to intelligent scenarios. It is also possible to use the chip model 10AX027H4F35I3SG in the era of fully intelligent systems.
The chip model 10AX027H4F35I3SG is a powerful tool for digital signal processing, embedded processing, and image processing. As technology advances, the chip model 10AX027H4F35I3SG can be used in more advanced applications, such as networks and intelligent scenarios. This chip model is designed to be used in conjunction with HDL language and can be used in the era of fully intelligent systems. With its wide range of applications, the chip model 10AX027H4F35I3SG is well-suited for a range of industries and is sure to be a key component in the future of technology.
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4,795 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $760.3705 | $760.3705 |
| 10+ | $752.1945 | $7,521.9448 |
| 100+ | $711.3143 | $71,131.4349 |
| 1000+ | $670.4342 | $335,217.1070 |
| 10000+ | $613.2020 | $613,202.0250 |
| The price is for reference only, please refer to the actual quotation! | ||